Ziitek TIF050AB-11S is a high-performance thermal conductive gel designed for CPU, PC, and GPU cooling applications. This two-component liquid gap filling material features excellent thermal conductivity of 5.0W/mK and cures to form a soft, dry elastomer for effective heat dissipation.

• High thermal conductivity: 5.0W/mK
• UL recognized certification
• Naturally tacky surface requiring no additional adhesive
• Two-part formulation for easy storage and handling
• High durability and reliability
• Optimized shear thinning characteristics for easy dispensing

• Notebook computers
• Set-top boxes
• Power box monitoring systems
• High-speed mass storage drives
• Heat sink applications for heat-generating semiconductors

Available in standard packaging: 50cc per piece (48 pieces per box) or 400cc per piece (9 pieces per box). Custom packaging in syringes for automated dispensing applications is also available upon request.

Ziitek Electronic Material and Technology Ltd. is a high-tech enterprise specializing in the research, development, and manufacturing of thermal interface materials. With advanced production equipment and comprehensive testing facilities, we provide UL94 V-0, SGS, and ROHS compliant thermal management solutions.