TIE 280-25AB Epoxy Potting Compound - 2.5W/mK Thermal Conductivity, 85 Shore D Hardness for Electronics
Price:
0.1-100USD/KG
MOQ:
2KG/LOT
Delivery Time:
2-3 work day
Brand:
Ziitek
Product Description
TIE™ 280-25AB High Thermal Conductive Epoxy Potting Compound
Product Overview
TIE™ 280-25AB is a two-component, high thermal conductive epoxy potting compound featuring low temperature curing, extended pot life, and fire-resistant properties. Specifically designed for capacitor potting and electrical device encapsulation.
Technical Documentation
Key Features
- High thermal conductivity: 2.5W/mK
- Excellent electrical insulation with smooth surface finish
- Low shrinkage during curing
- Low viscosity for efficient air release
- Superior solvent resistance and waterproof properties
- Extended service lifetime
- Excellent thermal shock efficiency and impact resistance
Applications
- Automotive starter potting and thermal detector encapsulation
- Ferrite adhesion and TIP type LED applications
- Relay sealant with excellent adhesion to rubber, ceramics, PCB, and plastics
- Power transformers, coils, and capacitor potting
- Small electrical device encapsulation
- LCD & substrate adhesion, coating, and sealant applications
- Coil, IGBT, transformer, and fire retardant applications
- Optical and medical component bonding
Material Specifications
| TIE™ 280-25A (Resin) | |
|---|---|
| Color | Black |
| Viscosity @25℃ Brookfield | 3,000 cPs |
| Specific Gravity | 2.1 g/cc |
| Shelf life @25℃ in sealed container | 12 months |
| TIE™ 280-25B (Hardener) | |
| Color | Black |
| Viscosity @25℃ Brookfield | 5,000 cPs |
| Shelf life @25℃ in sealed container | 12 months |
Processing Parameters
| Mix Ratio (By weight) | TIE™ 280-25A : TIE™ 280-25B = 100 : 100 |
| Viscosity @25℃ | 4,000 cPs |
| Working pot life (250 g @25℃) | 45 minutes |
| Specific Gravity | 2.1 g/cc |
| Cure Schedule | 12 hours at 25℃ or 30 minutes at 70℃ |
Cured Properties
| Hardness @25℃ | 85 Shore D |
| Service temperature | -40℃ to +130℃ |
| Glass transition temperature Tg | 92℃ |
| Elongation | 0.10% |
| Coefficient of thermal expansion | 3.0 × 10⁻⁵ /℃ |
| Fire resistance UL | Meet 94 V-0 |
| Moisture absorption (24 hours water immersion @25℃) | 0.1% wt gain |
Thermal & Electrical Properties
| Thermal Properties | |
|---|---|
| Thermal Conductivity | 2.5 W/m-K |
| Thermal Impedance @10psi | 0.31 ℃-in²/W |
| Electrical Properties (As Cured) | |
| Dielectric Strength | 300 volts/mil |
| Dielectric Constant | 4.2 MHz |
| Dissipation factor | 0.029 MHz |
| Volume resistivity @25℃ | 3.0 × 10¹² ohm-cm |
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronic Materials & Technology Ltd.
Location
No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai