TIE 280-25AB Epoxy Potting Compound - 2.5W/mK Thermal Conductivity, 85 Shore D Hardness for Electronics
Price:
0.1-100USD/KG
MOQ:
2KG/LOT
Delivery Time:
2-3 work day
Brand:
Ziitek
Product Description
TIE™ 280-25AB High Thermal Conductive Epoxy Potting Compound
Product Overview
TIE™ 280-25AB is a two-component, high thermal conductive epoxy potting compound featuring low temperature curing, extended pot life, and fire-resistant properties. Specifically designed for capacitor potting and electrical device encapsulation.
Technical Documentation
Key Features
- High thermal conductivity: 2.5W/mK
- Excellent electrical insulation with smooth surface finish
- Low shrinkage during curing
- Low viscosity for efficient air release
- Superior solvent resistance and waterproof properties
- Extended service lifetime
- Excellent thermal shock efficiency and impact resistance
Applications
- Automotive starter potting and thermal detector encapsulation
- Ferrite adhesion and TIP type LED applications
- Relay sealant with excellent adhesion to rubber, ceramics, PCB, and plastics
- Power transformers, coils, and capacitor potting
- Small electrical device encapsulation
- LCD & substrate adhesion, coating, and sealant applications
- Coil, IGBT, transformer, and fire retardant applications
- Optical and medical component bonding
Material Specifications
| TIE™ 280-25A (Resin) | |
|---|---|
| Color | Black |
| Viscosity @25℃ Brookfield | 3,000 cPs |
| Specific Gravity | 2.1 g/cc |
| Shelf life @25℃ in sealed container | 12 months |
| TIE™ 280-25B (Hardener) | |
| Color | Black |
| Viscosity @25℃ Brookfield | 5,000 cPs |
| Shelf life @25℃ in sealed container | 12 months |
Processing Parameters
| Mix Ratio (By weight) | TIE™ 280-25A : TIE™ 280-25B = 100 : 100 |
| Viscosity @25℃ | 4,000 cPs |
| Working pot life (250 g @25℃) | 45 minutes |
| Specific Gravity | 2.1 g/cc |
| Cure Schedule | 12 hours at 25℃ or 30 minutes at 70℃ |
Cured Properties
| Hardness @25℃ | 85 Shore D |
| Service temperature | -40℃ to +130℃ |
| Glass transition temperature Tg | 92℃ |
| Elongation | 0.10% |
| Coefficient of thermal expansion | 3.0 × 10⁻⁵ /℃ |
| Fire resistance UL | Meet 94 V-0 |
| Moisture absorption (24 hours water immersion @25℃) | 0.1% wt gain |
Thermal & Electrical Properties
| Thermal Properties | |
|---|---|
| Thermal Conductivity | 2.5 W/m-K |
| Thermal Impedance @10psi | 0.31 ℃-in²/W |
| Electrical Properties (As Cured) | |
| Dielectric Strength | 300 volts/mil |
| Dielectric Constant | 4.2 MHz |
| Dissipation factor | 0.029 MHz |
| Volume resistivity @25℃ | 3.0 × 10¹² ohm-cm |
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location
No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai