2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Thermal Gap Pad For CPU/LED/PCB/GPU/SSD
2.6W/M.K Thermal Conductive Pad Thermal Insulation Silicone Pad Thermal Gap Pad For CPU/LED/PCB/GPU/SSD
TIF®540BS is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces,and the susceptibility of delicate components to mechanical damage.
Features:
> Good thermal conductive : 2.6W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction
> Electrically isolating
Applications
> Cooling components to the
> chassis of frame
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Monitoring the Power Box
> AD-DC Power Adapters
> Rainproof LED Power
> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
| Typical Properties of TIF®500BS Series | |||
| Property | Value | Test method | |
| Color | Blue | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.03~0.200 | ASTM D374 |
| (0.25~0.75) | (0.75~5.0) | ||
| Hardness | 30 Shore 00 |
13 Shore 00 |
ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 5.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1013 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 2.6 W/m-K | ASTM D5470 | |
| 2.6 W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness:
0.010 to 0.20 (0.25 to 5.00 mm) with increments of 0.01 (0.25 mm).
Standard Size:
16"X16"(406 mm×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or moreinformation. please contact us.
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How long is your delivery time?
A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.