High Temp Resistance 2.6W/MK Soft Silicone Type Thermal Pad For Electronics
High Temp Resistance 2.6W/MK Soft Silicone Type Thermal Pad For Electronics
Products Description
TIF®580BS is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with an exceptionally gel-like softness, achieving a low-stress perfect fit. It is suitable for addressing issues in high-precision assemblies, such as large tolerances, uneven surfaces,and the susceptibility of delicate components to mechanical damage.
Features:
> Good thermal conductive : 2.6W/mK
> Naturally tacky needing no further adhesive coating
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
Applications
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Display card
> Mainboard/mother board
> Notebook
> Power supply
Key attributes
| Typical Properties of TIF®500BS Series | |||
| Property | Value | Test method | |
| Color | Blue | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.03~0.200 | ASTM D374 |
| (0.25~0.75) | (0.75~5.0) | ||
| Hardness | 30 Shore 00 | 13 Shore 00 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant | 5.0 MHz | ASTM D150 | |
| Volume Resistivity | ＞1.0X1013 Ohm-meter | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity | 2.6 W/m-K | ASTM D5470 | |
| 2.6 W/m-K | ISO22007 | ||
Product Specifications
Standard Thickness:
0.010 to 0.20 (0.25 to 5.00 mm) with increments of 0.01 (0.25 mm).
Standard Size:
16"X16"(406 mm×406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment). DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF® series is available in custom shapes and various forms.
For other thicknesses or moreinformation. please contact us.
Details Images
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How to find a right thermal conductivity for my applications
A: It depends on the watts of power source , ability of heat dissipation. Please tell us your detailed applications and the power, so we can recommend most suitable thermal conductive materials.
Q: Do you accept custom orders ?
A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.