Gray silicone thermal pad designed for efficient heat transfer in electronic and computer applications. Features ultra-soft construction and excellent thermal conductivity of 3.0W/mK.

Ziitek Electronic Material and Technology Ltd. specializes in thermal conductive materials research, development, and production. With advanced equipment and optimized processes, we provide comprehensive thermal solutions for diverse applications.

• Excellent thermal conductivity: 3.0W/mK
• Naturally adhesive surface eliminates need for additional coatings
• Soft and compressible design minimizes stress on components
• Available in multiple thickness options from 0.5mm to 5.0mm

• Cooling components to chassis or frame structures
• High-speed mass storage drives and memory modules
• LED TV backlight units and lighting systems
• Micro heat pipe thermal management solutions
• Automotive engine control units and telecommunication hardware
• Portable electronics and semiconductor test equipment

Standard sheet size: 8" x 16" (203mm x 406mm)

Custom die-cut shapes and specialized thicknesses available upon request. Contact us for specific requirements.

• "Do it right the First time" quality control philosophy
• Specialized expertise in thermal conductive interface materials
• Competitive product advantages and performance
• Confidentiality agreements and business protection
• Free sample program available
• Comprehensive quality assurance contracts