Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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TIF500US Series Thermal Interface Pad - 2.6 W/mK Conductive Silicon Gap Filler for GPU CPU Cooling 0.5-5.0mm Thickness

Price Negotiable
Price: negotiation
MOQ: 1000pcs
Delivery Time: 3-5 days
Brand: ZIITEK
Product Description
The TIF™500US Series thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat from electronic components to metal housings or dissipation plates, thereby enhancing efficiency and extending the lifespan of heat-generating devices.
Key Features
  • Excellent thermal conductivity: 2.6 W/mK
  • Naturally tacky surface requiring no additional adhesive
  • Soft and compressible design for low-stress applications
  • Available in various thicknesses from 0.5mm to 5.0mm
TIF500US Series thermal interface pad product image showing violet colored material
Applications
  • Cooling components to chassis or frame
  • High-speed mass storage drives
  • LED TV backlight units and LED lighting systems
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
Technical Specifications
Property Value Test Method
Color Violet Visual
Construction & Composition Ceramic filled silicone rubber ******
Thickness Range 0.020" (0.50mm) ~ 0.200" (5.0mm) ASTM D374
Specific Gravity 2.95 g/cc ASTM D297
Outgassing (TML) 0.55% ASTM C351
Hardness 18 Shore 00 ASTM 2240
Operating Temperature -40 to 160℃ ******
Dielectric Breakdown Voltage (T-1.0mm) >5500 VAC ASTM D149
Dielectric Constant @1MHZ 4.3 ASTM D150
Volume Resistivity 4.2×10¹³ Ohm-meter ASTM D257
Flame Rating 94-V0 equivalent UL
Thermal Conductivity 2.6 W/m-K ASTM D5470
Product Dimensions
Standard sheet size: 8" × 16" (203mm × 406mm)
Custom die-cut shapes and thicknesses available upon request
TIF500US Series thermal pad packaging and manufacturing process
Packaging & Lead Time
Packaging Features:
• PET film or foam protection layers
• Paper card separation between layers
• Export-grade carton packaging
• Custom packaging available

Lead Time: 5,000 pieces - negotiable delivery schedule
Frequently Asked Questions
Are you a trading company or manufacturer?
We are a manufacturer based in China.
How long is your delivery time?
Standard delivery: 3-7 working days for in-stock items, 7-10 working days for custom orders based on quantity.
Do you provide samples? Is there any cost?
Yes, we offer samples free of charge.
Ziitek Electronic Material and Technology manufacturing facility and capabilities
About Ziitek
Ziitek Electronic Material and Technology Ltd. specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. With extensive experience in thermal engineering, we provide customized products, comprehensive product lines, and flexible production capabilities to serve as your reliable thermal management partner.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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