Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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TIA810FG Series Thermal Conductive Adhesive Tape 1.2 W/mK with 0.010" Thickness for LED Heat Sink Bonding

Price Negotiable
Price: Negotiable
MOQ: 10SQM
Delivery Time: 2-3Work day
Brand: Ziitek
Product Description
Product Overview

The TIA™810FG Series thermal conductive adhesive tape is engineered for bonding heat dissipation components in electronic applications. This ceramic-filled silicone elastomer adhesive provides superior thermal management while eliminating the need for thermal grease and mechanical fasteners.

Key Features
  • Thermal Conductivity: 1.2 W/mK for efficient heat transfer
  • High bond strength to various surfaces with double-sided pressure sensitive adhesive
  • High-performance thermally conductive acrylic adhesive formulation
  • Ultimate bonding strength with low thermal impedance
Applications
  • Mounting heat sinks onto BGA graphic processors and drive processors
  • Mounting heat spreaders onto power converter PCBs and motor control PCBs
  • Replacement for heat cure adhesives, screw mounting, or clip mounting
  • Bonding heat dissipation fins, microprocessors, and power consumption semiconductors
Technical Specifications
Product Name TIA™805FG TIA™806FG TIA™808FG TIA™810FG TIA™815FG TIA™820FG Test Method
Composite Thickness 0.005" (0.127mm) 0.006" (0.152mm) 0.008" (0.203mm) 0.010" (0.254mm) 0.015" (0.381mm) 0.020" (0.508mm) ASTM D374
Glass Fiber Thickness ±0.001" (±0.025mm) ±0.001" (±0.025mm) ±0.0012" (±0.03mm) ±0.0012" (±0.03mm) ±0.0015" (±0.038mm) ±0.002" (±0.05mm) ASTM D374
Voltage Breakdown > 2000 Vac > 2000 Vac > 2300 Vac > 3000 Vac > 3500 Vac > 3500 Vac ASTM D149
Thermal Impedance @50psi 0.52℃-in²/W 0.59℃-in²/W 0.83℃-in²/W 0.91℃-in²/W 1.15℃-in²/W 1.43℃-in²/W ASTM D5470
Additional Properties

Color: White

Adhesive Type: Acrylic Adhesive

Backing Type: Glass fiber

Peel Adhesion: 1200 g/inch² (JIS K02378)

Holding Power 25℃/Days: > 120 kg/inch² (JIS K023711)

Holding Power 120℃/Hours: > 10 kg/inch² (JIS K023711)

Recommend Using Pressure: 10 psi

Thermal Conductivity: 1.2 W/mK

Available Options
Standard Thicknesses

0.005" (0.127mm), 0.006" (0.152mm), 0.008" (0.203mm), 0.010" (0.254mm), 0.015" (0.381mm), 0.020" (0.508mm)

Consult the factory for alternate thickness options

Standard Sizes

10" x 18" (254mm x 457mm)

10" x 400' (254mm x 121.9M)

Individual die cut shapes can be supplied upon request

Reinforcement

TIA™800 Series sheets are fiberglass reinforced for enhanced durability and performance.

TIA810FG Series thermal conductive adhesive tape product image

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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