Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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Chemicals Adhesives & Sealants

TIE™ 280-12AB Black Two Component Epoxy Thermal Conductive Glue 1.2W/mK for LED Lighting -40℃ to +130℃

Price Negotiable
Price: Negotiable
MOQ: 2kg/LOT
Delivery Time: 2-3 work day
Brand: Ziitek
Product Description
TIE™ 280-12AB Two Component Epoxy Thermal Conductive Glue
Product Overview

Black two-component epoxy thermal conductive adhesive paste with 1.2W/mK thermal conductivity, designed for LED lighting applications. Features excellent waterproof properties and operates effectively from -40℃ to +130℃.

Key Features
  • High thermal conductivity: 1.2W/mK
  • Excellent electrical insulation and smooth surface finish
  • Low shrinkage during curing process
  • Low viscosity for efficient air release
  • Superior waterproof and solvent resistance
  • Extended operational lifetime
  • Excellent thermal shock efficiency and impact resistance
  • UL 94 V-0 fire resistance rating
Applications
  • Automotive starters potting and thermal detector potting
  • Ferrite adhesion and TIP type LED applications
  • Relay sealant with excellent adhesion to rubber, ceramics, PCB and plastics
  • Power transformers, coils, and capacitor potting
  • Small electrical device encapsulation
  • Metal, glass, and plastic adhesion for LCD & substrates
  • Coating, sealant, coil, IGBT, and transformer applications
  • Optical and medical component adhesive
Material Specifications
Uncured Material Properties
Component Property Value
TIE™ 280-12A (Resin) Color Black
Viscosity @25℃ Brookfield 3,000 cPs
Specific Gravity 1.6 g/cc
Shelf life @25℃ in sealed container 12 months
TIE™ 280-12B (Hardener) Color Black
Viscosity @25℃ Brookfield 5,000 cPs
Shelf life @25℃ in sealed container 12 months
Mixing and Curing Parameters
Parameter Value
Mix Ratio (By weight) TIE™ 280-12A : TIE™ 280-12B = 100 : 100
Viscosity @25℃ 4,000 cPs
Working pot life (250 g @25℃) 45 minutes
Specific Gravity 1.6 g/cc
Cure Schedule 12 hours at 25℃ or 30 minutes at 70℃
Cured Material Properties
Property Value
Hardness @25℃ 85 Shore D
Service temperature -40℃ to +130℃
Glass transition temperature Tg 92℃
Elongation 0.10%
Coefficient of thermal expansion 3.0 × 10⁻⁵ /℃
Fire resistance UL Meet 94 V-0
Moisture absorption % wt gain (24h water immersion @25℃) 0.1
Thermal and Electrical Properties
Property Value
Thermal Impedance @10psi 0.36 ℃-in²/W
Dielectric Strength 300 volts / mil
Dielectric Constant 4.2 MHz
Dissipation factor 0.029 MHz
Volume resistivity @25℃ 3.0 × 10¹² ohm-cm
TIE™ 280-12AB Two Component Epoxy Thermal Conductive Glue product packaging and application example

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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