Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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TIE 280-25AB Thermally Conductive Epoxy Potting Compound 2.5 W/m-K for -40℃ to +130℃ Applications

Price Negotiable
Price: 0.1-100USD/KG
MOQ: 2KG/LOT
Delivery Time: 2-3 work day
Brand: Ziitek
Product Description
TIE™ 280-25AB Thermally Conductive Epoxy Potting Compound
Product Overview

TIE™ 280-25AB is a two-component, high thermal conductivity epoxy encapsulant compound featuring low temperature curing, extended pot life, and fire-resistant properties. Specifically engineered for potting capacitors and electrical devices with operating temperatures from -40℃ to +130℃.

Key Features & Benefits
  • High thermal conductivity: 2.5 W/m-K for efficient heat dissipation
  • Excellent electrical insulation properties with smooth surface finish
  • Low shrinkage during curing process
  • Low viscosity formulation facilitates air bubble release
  • Superior resistance to solvents and waterproof performance
  • Extended service life and durability
  • Excellent thermal shock efficiency and impact resistance
  • UL 94 V-0 fire resistance rating
Primary Applications
  • Automotive starters potting and thermal detector potting
  • Ferrite adhesion and TIP type LED applications
  • Relay sealant with excellent adhesion to rubber, ceramics, PCB and plastics
  • Power transformers and coils encapsulation
  • Potting capacitors and small electrical devices
  • Adhesion to metal, glass, and plastic substrates
  • LCD & substrate adhesion, coating and sealant applications
  • Coil, IGBT, and transformer potting solutions
  • Optical and medical component adhesive requirements
Material Specifications
Uncured Material Properties
Component Property Value
TIE™ 280-25A (Resin) Color Black
Viscosity @25℃ Brookfield 3,000 cPs
Specific Gravity 2.1 g/cc
Shelf life @25℃ in sealed container 12 months
TIE™ 280-25B (Hardener) Color Black
Viscosity @25℃ Brookfield 5,000 cPs
Shelf life @25℃ in sealed container 12 months
Mixing & Curing Parameters
Parameter Value
Mix Ratio (By weight) TIE™ 280-25A : TIE™ 280-25B = 100 : 100
Viscosity @25℃ 4,000 cPs
Working pot life (250 g @25℃) 45 minutes
Specific Gravity 2.1 g/cc
Cure Schedule 12 hours at 25℃ or 30 minutes at 70℃
Cured Material Properties
Property Value
Hardness @25℃ 85 Shore D
Service temperature -40℃ to +130℃
Glass transition temperature Tg 92℃
Elongation 0.10%
Coefficient of thermal expansion 3.0 × 10⁻⁵ /℃
Fire resistance UL Meet 94 V-0
Moisture absorption % wt gain (24h water immersion @25℃) 0.1
Thermal & Electrical Properties
Category Property Value
Thermal Thermal Conductivity 2.5 W/m-K
Thermal Impedance @10psi 0.31 ℃-in²/W
Electrical Dielectric Strength 300 volts / mil
Dielectric Constant 4.2 MHz
Dissipation factor 0.029 MHz
Volume resistivity, ohm-cm @ 25℃ 3.0 × 10¹²
TIE™ 280-25AB Thermally Conductive Epoxy Potting Compound product image showing application and packaging

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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