Dongguan Ziitek Electronical Material and Technology Co., Ltd
                                                                                                           
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TIE 280-25AB Thermally Conductive Epoxy Potting Compound 2.5 W/m-K for -40℃ to +130℃ Applications

Price Negotiable
Price: 0.1-100USD/KG
MOQ: 2KG/LOT
Delivery Time: 2-3 work day
Brand: Ziitek
Product Description
TIE™ 280-25AB Thermally Conductive Epoxy Potting Compound
Product Overview

TIE™ 280-25AB is a two-component, high thermal conductivity epoxy encapsulant compound featuring low temperature curing, extended pot life, and fire-resistant properties. Specifically engineered for potting capacitors and electrical devices with operating temperatures from -40℃ to +130℃.

Key Features & Benefits
  • High thermal conductivity: 2.5 W/m-K for efficient heat dissipation
  • Excellent electrical insulation properties with smooth surface finish
  • Low shrinkage during curing process
  • Low viscosity formulation facilitates air bubble release
  • Superior resistance to solvents and waterproof performance
  • Extended service life and durability
  • Excellent thermal shock efficiency and impact resistance
  • UL 94 V-0 fire resistance rating
Primary Applications
  • Automotive starters potting and thermal detector potting
  • Ferrite adhesion and TIP type LED applications
  • Relay sealant with excellent adhesion to rubber, ceramics, PCB and plastics
  • Power transformers and coils encapsulation
  • Potting capacitors and small electrical devices
  • Adhesion to metal, glass, and plastic substrates
  • LCD & substrate adhesion, coating and sealant applications
  • Coil, IGBT, and transformer potting solutions
  • Optical and medical component adhesive requirements
Material Specifications
Uncured Material Properties
Component Property Value
TIE™ 280-25A (Resin) Color Black
Viscosity @25℃ Brookfield 3,000 cPs
Specific Gravity 2.1 g/cc
Shelf life @25℃ in sealed container 12 months
TIE™ 280-25B (Hardener) Color Black
Viscosity @25℃ Brookfield 5,000 cPs
Shelf life @25℃ in sealed container 12 months
Mixing & Curing Parameters
Parameter Value
Mix Ratio (By weight) TIE™ 280-25A : TIE™ 280-25B = 100 : 100
Viscosity @25℃ 4,000 cPs
Working pot life (250 g @25℃) 45 minutes
Specific Gravity 2.1 g/cc
Cure Schedule 12 hours at 25℃ or 30 minutes at 70℃
Cured Material Properties
Property Value
Hardness @25℃ 85 Shore D
Service temperature -40℃ to +130℃
Glass transition temperature Tg 92℃
Elongation 0.10%
Coefficient of thermal expansion 3.0 × 10⁻⁵ /℃
Fire resistance UL Meet 94 V-0
Moisture absorption % wt gain (24h water immersion @25℃) 0.1
Thermal & Electrical Properties
Category Property Value
Thermal Thermal Conductivity 2.5 W/m-K
Thermal Impedance @10psi 0.31 ℃-in²/W
Electrical Dielectric Strength 300 volts / mil
Dielectric Constant 4.2 MHz
Dissipation factor 0.029 MHz
Volume resistivity, ohm-cm @ 25℃ 3.0 × 10¹²
TIE™ 280-25AB Thermally Conductive Epoxy Potting Compound product image showing application and packaging

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Co., Ltd
Location No.12 Xiju Road, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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