TIE 380-25 One Component Epoxy Thermal Conductive Adhesive 2.5 W/m·K with 140,000 cPs Viscosity for Industrial Applications
Price:
Negotiable
MOQ:
1KG
Delivery Time:
2-3 Work day
Brand:
Ziitek
Product Description
Product Overview
TIE™380-25 is a high-performance, one-component epoxy thermal conductive adhesive designed for industrial applications requiring efficient heat dissipation and strong bonding capabilities.
Key Features
- Excellent thermal conductivity: 2.5 W/m·K
- Superior adhesion performance and maneuverability
- Low shrinkage during curing process
- Low viscosity for easy application and reduced gas emissions
- Excellent solvent and water resistance
- Extended working time for complex assemblies
- Outstanding resistance to thermal shock
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Chemical Type | Epoxy | - |
| Appearance (Uncured) | Gray Paste | Visual |
| Appearance (Cured) | Dull Gray Solid | Visual |
| Components | One Component | - |
| Heat Capacity | 0.7 J/g·K | ASTM C351 |
| Key Substrates | Metals, Ceramics | - |
| Hardness | 92 Shore A | ASTM 2240 |
| Continuous Use Temperature | -40 to 180°C | - |
| Tensile Strength (Al/Al @25°C) | >2800 psi | - |
| Thermal Conductivity | 2.5 W/m·K | ASTM D5470 |
Application Properties
Physical Characteristics
| Color | Gray |
| Viscosity @25°C | 140,000 cPs |
| Specific Gravity @25°C | 2.1 g/cc |
Shelf Life
| @25°C | 10 Days |
| @0°C | 6 Months |
Storage methods and temperature will affect the shelf life
Curing Procedures
| Curing Temperature | Curing Time |
|---|---|
| 100°C | 3 Hours |
| 125°C | 1.5 Hours |
| 150°C | 20 Minutes |
| 170°C | 5 Minutes |
Similar Products
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronic Materials & Technology Ltd.
Location
No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai