Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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Since 2006
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TIS TM800 Series Gray Heatsink Cooling Material 1.6 W/m-K Thermal Conductivity 0.006-0.018 inch Thickness

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000PCS
Delivery Time: 2-3Word days
Brand: Ziitek
Product Description
TIS ™800 Series High-Efficiency Thermal Interface Material

The TIS ™800 Series represents advanced thermal interface materials engineered with exceptional thermal conductivity and electrical insulation properties. These gray heatsink cooling materials feature ceramic-filled silicone rubber construction with integrated insulation base film for optimal performance.

Key Features
  • High thermal conductivity of 1.6 W/m-K for efficient heat dissipation
  • Excellent dielectric strength with breakdown voltages from 1500 to 5000 VAC
  • Low thermal resistance with impedance ranging from 0.21 to 1.83 ℃-in²/W
  • High compliance surface characteristics for optimal contact
  • Superior resistance to tears, punctures, and mechanical stress
  • UL 94 V-0 fire rating for enhanced safety
Applications
  • Power conversion equipment and power semiconductors
  • MOSFETs, IGBTs, and semiconductor packages
  • Audio and video components requiring thermal management
  • Automotive control units and motor controllers
  • General high-pressure interface applications
Technical Specifications
Property TIS TM806 TIS TM808 TIS TM810 TIS TM812 TIS TM818 Test Method
Composite Thickness 0.006"/0.152 mm 0.008"/0.203 mm 0.010"/0.254 mm 0.012"/0.304 mm 0.018"/0.457 mm ASTM D751
Tensile Strength 450 psi >600 psi >600 psi >600 psi >600 psi ASTM D412
Dielectric Breakdown Voltage >1500 VAC >3500 VAC >5000 VAC >5000 VAC >5000 VAC ASTM D149
Thermal Impedance @50psi 0.21℃-in²/W 0.35℃-in²/W 0.82℃-in²/W 1.23℃-in²/W 1.83℃-in²/W ASTM D5471
Additional Properties
Specific Gravity: 2.2 g/cc
Heat Capacity: 1 J/g-K
Hardness: 50 Shore A
Continuous Use Temperature: -50 to 180℃ (-58 to 356℉)
Thermal Conductivity: 1.6 W/m-K
Volume Resistivity: 5.0×10¹² Ohm-meter
Available Thicknesses

0.005" (0.127mm), 0.006" (0.152mm), 0.008" (0.203mm), 0.009" (0.228mm), 0.010" (0.254mm), 0.012" (0.304mm), 0.018" (0.457mm)

Standard Sizes

16" × 18" (406mm × 457mm)
16" × 200' (406mm × 60.9M)

Custom Options
  • Pressure sensitive adhesive available on one side (A1 suffix) or both sides (A2 suffix)
  • Individual die-cut shapes upon request
  • Fiberglass reinforced construction
  • Consult factory for alternate thickness requirements
TIS 800 Series Thermal Interface Material product image showing gray heatsink cooling material
Technical Documentation

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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