TIE 280-25AB Thermal Conductive Epoxy Adhesive 2.5W/mK with 85 Shore D Hardness and -40℃ to 130℃ Range
Price:
0.1-100USD/KG
MOQ:
2KG/LOT
Delivery Time:
2-3 work day
Brand:
Ziitek
Product Description
TIE™ 280-25AB Thermal Conductive Epoxy Adhesive
Product Overview
TIE™ 280-25AB is a two-component, high thermal conductivity epoxy encapsulant compound featuring low viscosity, long pot life, and fire resistance. Designed for potting capacitors and electrical devices with excellent thermal management properties.
Key Features
- High thermal conductivity: 2.5W/mK
- Excellent electrical insulation with smooth surface finish
- Low shrinkage during curing process
- Low viscosity for easy application and air release
- Superior solvent resistance and waterproof properties
- Extended operational lifetime
- Excellent thermal shock efficiency and impact resistance
Applications
- Automotive starters potting and thermal detector potting
- Ferrite adhesion and TIP type LED applications
- Relay sealants with adhesion to rubber, ceramics, PCB and plastics
- Power transformers, coils, and capacitor potting
- Small electrical device encapsulation
- Metal, glass, and plastic adhesion for LCD & substrates
- Coating and sealant applications for optical/medical components
- IGBTs and transformer fire retardant solutions
Material Specifications
| Uncured Material Properties | |
|---|---|
| TIE™ 280-25A (Resin) | |
| Color | Black |
| Viscosity @25℃ Brookfield | 3,000 cPs |
| Specific Gravity | 2.1 g/cc |
| Shelf life @25℃ in sealed container | 12 months |
| TIE™ 280-25B (Hardener) | |
| Color | Black |
| Viscosity @25℃ Brookfield | 5,000 cPs |
| Shelf life @25℃ in sealed container | 12 months |
Processing Information
| Mix Ratio (By weight) | TIE™ 280-25A : TIE™ 280-25B = 100 : 100 |
| Viscosity @25℃ | 4,000 cPs |
| Working pot life (250 g @25℃) | 45 minutes |
| Specific Gravity | 2.1 g/cc |
| Cure Schedule | |
| Standard cure | 12 hours at 25℃ |
| Accelerated cure | 30 minutes at 70℃ |
Cured Material Properties
| Hardness @25℃ | 85 Shore D |
| Service temperature | -40℃ to +130℃ |
| Glass transition temperature Tg | 92℃ |
| Elongation | 0.10% |
| Coefficient of thermal expansion | 3.0 × 10⁻⁵ /℃ |
| Fire resistance UL | Meet 94 V-0 |
| Moisture absorption % wt gain (24h water immersion @25℃) | 0.1 |
Thermal & Electrical Properties
| Thermal Properties | |
|---|---|
| Thermal Conductivity | 2.5 W/m-K |
| Thermal Impedance @10psi | 0.31 ℃-in²/W |
| Electrical Properties (As Cured) | |
| Dielectric Strength | 300 volts / mil |
| Dielectric Constant | 4.2 MHz |
| Dissipation factor | 0.029 MHz |
| Volume resistivity, ohm-cm @ 25℃ | 3.0 × 10¹² |
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronic Materials & Technology Ltd.
Location
No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person
Dana Dai