Dongguan Ziitek Electronic Materials & Technology Ltd.
                                                                                                           
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TIC™808P Series 0.95 W/mK Thermal Conductivity Phase Change Material for IGBTs and Processors

Price Negotiable
Price: negotiation
MOQ: 1000PCS
Delivery Time: 3-5 work days
Brand: Ziitek
Product Description
TIC™808P Series Phase Change Thermal Interface Materials
Product Overview

TIC™808P series are low melting point thermal interface materials designed for high-performance thermal management applications. At 50°C, the material softens and flows to fill microscopic surface irregularities, significantly reducing thermal resistance between components.

Key Applications
  • High Frequency Microprocessors
  • Notebook and Desktop PCs
  • Computer Servers
  • Memory Modules
  • Cache Chips
  • IGBTs (Insulated Gate Bipolar Transistors)
Product Features
  • 0.014℃-in²/W thermal resistance for optimal heat transfer
  • 0.95 W/mK thermal conductivity rating
  • Naturally tacky at room temperature - no adhesive required
  • No heat sink preheating required for installation
  • Flexible solid at room temperature, freestanding without reinforcing components
  • No thermal performance degradation after 1,000 hours at 130°C or 500 cycles from -25°C to 125°C
  • Minimal migration (pump out) at operating temperatures
Technical Specifications
Property TIC™803P TIC™805P TIC™808P TIC™810P Testing Standards
Color Pink Pink Pink Pink Visual
Composite Thickness 0.003" (0.076mm) 0.005" (0.126mm) 0.008" (0.203mm) 0.010" (0.254mm)
Thickness Tolerance ±0.0006" (±0.016mm) ±0.0008" (±0.019mm) ±0.0008" (±0.019mm) ±0.0012" (±0.030mm)
Thermal Impedance @ 50 psi 0.021℃-in²/W (0.14℃-cm²/W) 0.024℃-in²/W (0.15℃-cm²/W) 0.053℃-in²/W (0.34℃-cm²/W) 0.080℃-in²/W (0.52℃-cm²/W) ASTM D5470 (modified)
Additional Specifications
  • Density: 2.2 g/cc (Helium Pycnometer)
  • Operating Temperature Range: -25°C to 125°C
  • Phase Transition Temperature: 50°C to 60°C
  • Thermal Conductivity: 0.95 W/mK (ASTM D5470 modified)
Standard Thickness Options

0.005" (0.127mm) | 0.008" (0.203mm) | 0.010" (0.254mm) | 0.012" (0.305mm)

Consult factory for alternate thickness requirements.

Standard Sizes
  • 10" x 16" (254mm x 406mm)
  • 16" x 400' (406mm x 121.92M)
Packaging & Configuration

TIC™800 series are supplied with white release paper and bottom liner. Available in kiss cut, extended pull tab liner, or individual die cut shapes to meet specific application requirements.

TIC™808P Series Phase Change Thermal Interface Material product image showing pink thermal pad

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronic Materials & Technology Ltd.
Location No.12 Xiju Road,, Hengli Township, 523465 Dongguan City
Contact Person Dana Dai

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