The TIF100-20-11S Series Gray High Voltage Isolation Heatsink Thermal Pads are advanced thermally conductive interface materials designed to fill air gaps between heating elements and heat dissipation components. These non-toxic pads feature excellent thermal conductivity of 2.0W/mK and 60 Shore 00 hardness, making them ideal for micro heat pipe applications and various electronic cooling solutions.

• Excellent thermal conductivity: 2.0W/mK
• Naturally tacky surface requiring no additional adhesive
• Soft and compressible design for low-stress applications
• Available in multiple thickness options from 0.25mm to 5.08mm
• High dielectric breakdown voltage: >10,000 VAC
• Fire rating: 94 V0 (equivalent UL standard)
• Wide operating temperature range: -50°C to 200°C

• Cooling components to chassis or frame structures
• High-speed mass storage drives
• LED TV backlight units and LED lighting systems
• RDRAM memory modules
• Micro heat pipe thermal management solutions
• Automotive engine control units
• Telecommunication hardware
• Handheld portable electronics
• Semiconductor automated test equipment (ATE)

0.010" (0.25mm), 0.020" (0.51mm), 0.030" (0.76mm), 0.040" (1.02mm), 0.050" (1.27mm), 0.060" (1.52mm), 0.070" (1.78mm), 0.080" (2.03mm), 0.090" (2.29mm), 0.100" (2.54mm), 0.110" (2.79mm), 0.120" (3.05mm), 0.130" (3.30mm), 0.140" (3.56mm), 0.150" (3.81mm), 0.160" (4.06mm), 0.170" (4.32mm), 0.180" (4.57mm), 0.190" (4.83mm), 0.200" (5.08mm)

8" × 16" (203mm × 406mm), 16" × 18" (406mm × 457mm)

Individual die-cut shapes available upon request. Pressure-sensitive adhesive options: single-side (A1 suffix) or double-side (A2 suffix). Fiberglass reinforcement available for sheet types.