Ziitek TIC 800K Series 1.8W Phase Change Material for CPU GPU Cooling 0.127mm to 0.203mm Thickness
The Ziitek TIC™800K Series is a high-performance phase change material designed for thermal management in electronic applications. This ceramic-filled compound coated on MT Kapton film provides excellent thermal conductivity and dielectric performance for CPU and GPU cooling solutions.
At 50°C, the material softens and flows to fill microscopic surface irregularities between thermal solutions and integrated circuit packages, effectively reducing thermal resistance and improving heat dissipation.
- Naturally tacky at room temperature - no adhesive required
- No heat sink preheating needed for installation
- Low thermal resistance for efficient heat transfer
- High thixotropic index for stable application
- Dry to the touch for pre-apply applications
- High thermal reliability with minimal pump-out
- Re-flow compatible for manufacturing processes
- Cost-effective thermal management solution
- Low volatility - less than 1%
- Easy handling in manufacturing environments
- Flows without running like traditional grease
- Available in custom die-cut shapes and kiss-cut rolls
- RoHS compliant for environmental safety
- High frequency microprocessors
- Notebook and desktop computers
- Computer servers and memory modules
- Cache chips and chipsets
- IGBTs and power semiconductors
- COB LED applications
- Graphic processing chips
- Power conversion modules
- LED power supplies and controllers
- LED lighting and ceiling lamps
| Property | TIC™805K | TIC™806K | TIC™808K | Test Method |
|---|---|---|---|---|
| Color | Light Amber | Visual | ||
| Composite Thickness | 0.004"/0.102mm | 0.005"/0.127mm | 0.006"/0.152mm | ASTM D374 |
| MT Kapton® Thickness | 0.001"/0.025mm | 0.001"/0.025mm | 0.002"/0.050mm | ASTM D374 |
| Total Thickness | 0.005"/0.127mm | 0.006"/0.152mm | 0.008"/0.203mm | ASTM D374 |
| Specific Gravity | 2.0 g/cc | ASTM D297 | ||
| Heat Capacity | 1 J/g-K | ASTM C351 | ||
| Tensile Strength | >13.5 Kpsi | >13.5 Kpsi | >17.8 Kpsi | ASTM D412 |
| Continuous Use Temp | -50°C to 130°C (-58°F to 266°F) | *** | ||
| Dielectric Breakdown Voltage | >4000 VAC | >5000 VAC | >6000 VAC | ASTM D149 |
| Dielectric Constant | 1.8 MHz | ASTM D150 | ||
| Volume Resistivity | 3.5×10¹⁴ Ohm-meter | ASTM D257 | ||
| Thermal Conductivity | 1.6 W/mK | ASTM D5470 | ||
| Thermal Impedance @50psi | 0.12°C-in²/W | 0.13°C-in²/W | 0.16°C-in²/W | ASTM D5470 |
Standard Thicknesses: 0.005" (0.127mm), 0.006" (0.152mm), 0.008" (0.203mm)
Standard Sizes: 10" × 100' (254mm × 30.48M)
Pressure Sensitive Adhesive: Not applicable for TIC™800K series products
Reinforcement: Kapton® reinforced sheets
Individual die-cut shapes and custom thicknesses available upon request.
Ziitek Electronic Material and Technology Ltd. specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. With extensive experience in thermal engineering, we provide customized products, comprehensive product lines, and flexible production capabilities to be your reliable thermal management partner.
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