Stable Chemical Performance Light 3W Thermal Conductive Gap Filler Pad For Cpu
Stable Chemical Performance Light 3W Thermal Conductive Gap Filler Pad For Cpu
The TIF®100-30-23E thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive: 3 W/mK
> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness
Applications:
> IGBTs
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
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Typical Properties of TIF®100-30-23E Series
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Color
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The light blue |
Visual |
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Construction &
Compostion |
Ceramic filled silicone rubber
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*** |
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Specific Gravity
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2.50 g/cc |
ASTM D297 |
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Heat Capacity
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1 l/g-K |
ASTM C351 |
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Hardness
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35 Shore 00 | ASTM 2240 |
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Tensile Strength
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48 psi |
ASTM D412 |
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Continuos Use Temp
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-50 to 200℃ |
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| Dielectric Breakdown Voltage | >10000 VAC | ASTM D149 |
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Dielectric Constant
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10.2 MHz | ASTM D150 |
| Volume Resistivity | 7.3X1012 Ohm-meter | ASTM D257 |
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Fire rating
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94 V0 |
equivalent UL |
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Thermal conductivity
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3 W/m-K | ASTM D5470 |
Standard Sheets Sizes:
8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.
Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.
Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.
Company Profile
Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications. Ziitek provide thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products and so on, for various applications.
FACTORY INFORMATION:
Factory Size
5,000-10,000 square meters
Factory Country/Region
Building B8, Industry District Ⅱ, Xicheng, Hengli Township, Dongguan City, Guangdong Province, P.R.China
Annual Output Value
US$1 Million - US$2.5 Million
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.