Zpaster140-20-11F Non-Silicone Thermal Pad 2.0 W/mK 1mm Thickness for Battery and Electronics Cooling

Price Negotiable

Price: negotiation

MOQ: 1000pcs

Delivery Time: 3-5 days

Brand: ZIITEK

Product Description

High Performance Compressible Non-Silicone Thermal Pad

Zpaster140-20-11F is a premium silicone-free thermal gap pad designed for advanced thermal management applications. This 2.65 g/cc density, 1mm thick thermal interface material effectively fills air gaps between heating elements and heat dissipation components.

Key Features

Silicone-free formulation for sensitive applications
ROHS compliance for environmental safety
Excellent thermal conductivity: 2.0 W/mK
Soft and compressible design for low stress applications
Available in various thicknesses from 0.25mm to 5.0mm

Applications

Car Battery & Power Supply Systems
Charging Pile Infrastructure
Silicone-sensitive electronic applications
Graphics Card Thermal Modules
Set Top Box Electronics
Medical Devices
LED Lighting Systems
SFP Optical Modules

Technical Specifications

Property	Value	Test Method
Color	Dark Grey	Visual
Construction	Silicone-free metal oxide fills	-
Thermal Conductivity	2.0 W/mK	ASTM D5470
Hardness	65 Shore 00	ASTM 2240
Specific Gravity	2.65 g/cc	ASTM D297
Thickness Range	0.25mm to 5.0mm	ASTM D374
Dielectric Breakdown Voltage	>5000 VAC	ASTM D149
Dielectric Constant	5.5 MHz	ASTM D150
Volume Resistivity	6.0×10¹³ Ohm-meter	ASTM D257
Continuous Use Temperature	-20°C to 125°C	-
Outgassing (TML)	0.30%	ASTM E595
Flame Rating	94 V0	Equivalent to

Standard Size Options

Available in thicknesses from 0.010-inch to 0.200-inch (0.25mm to 5.0mm). Proprietary NS1 option available to eliminate tack from one side for improved handling.