TIF015-07 Thermal Conductive Gel 1.5W/mK for Electronic Components Cooling -45°C to 200°C Operating Range
TIF015-07 is a soft silicone putty thermal gap filler with an exclusive formula that delivers superior thermal performance and excellent compressibility. The high viscosity silicone oil base prevents thermal compound separation and provides better control over bonded shifting compared to traditional thermal pads.
Similar to thermal grease application, TIF015-07 can be applied using silk screening, screen printing, or automated injection facilities for efficient production processes.
- Chip micro processors and PPGA packages
- Micro BGA and BGA package cooling
- DSP chips and high-power electronic components
- LED lighting systems and backlight modules
- Heat-sink and frame thermal management
- Thermal conductivity: 1.5W/mK
- Soft texture with very low compression force
- Excellent moldability for complex component shapes
- Suitable for audio/video components and IT infrastructure
- Ideal for GPS navigation and portable devices
- Effective for CD-ROM and DVD-ROM cooling applications
| Property | Value | Test Method |
|---|---|---|
| Color | Green | Visual |
| Construction & Composition | Ceramic filled silicon material | ***** |
| Viscosity | 4000 Pa.s | GB/T 10247 |
| Specific Gravity | 2.5g/cm³ | ASTM D297 |
| Thermal Conductivity | 1.5 W/mK | ISO 22007-2 |
| Thermal Diffusivity | 0.847 mm²/s | ISO 22007-2 |
| Specific Heat Capacity | 2.2 MJ/m3K | ISO 22007-2 |
| Continuous Use Temperature | -45°C to 200°C | ****** |
| Flame Rating | 94V0 | UL E331100 |
Standard packaging: 30 cc/pc, 98 pc/box; 300 cc/pc, 6 pc/box
Custom syringe packaging available for automated dispensing applications. Please contact us for specific packaging requirements.
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