The TIF120-02S Series thermally conductive silicone pads are engineered to fill air gaps between heat-generating components and cooling surfaces. These flexible, compressible materials ensure optimal thermal transfer while accommodating uneven surfaces, significantly enhancing the performance and longevity of electronic devices.

• Available in multiple thicknesses with 1.5 W/mK thermal conductivity
• Broad range of hardness options for various applications
• Excellent moldability for complex component shapes
• Outstanding thermal performance and reliability
• High tack surface minimizes contact resistance
• RoHS compliant for environmental safety

• Power supply units and heat pipe thermal solutions
• Memory modules and mass storage devices
• Automotive electronics and set-top boxes
• Audio/video components and IT infrastructure
• GPS navigation systems and portable devices

0.010" (0.25mm), 0.020" (0.51mm), 0.030" (0.76mm), 0.040" (1.02mm), 0.050" (1.27mm), 0.060" (1.52mm), 0.070" (1.78mm), 0.080" (2.03mm), 0.090" (2.29mm), 0.100" (2.54mm), 0.110" (2.79mm), 0.120" (3.05mm), 0.130" (3.30mm), 0.140" (3.56mm), 0.150" (3.81mm), 0.160" (4.06mm), 0.170" (4.32mm), 0.180" (4.57mm), 0.190" (4.83mm), 0.200" (5.08mm)

8" x 16" (203mm x 406mm) and 16" x 18" (406mm x 457mm)

• Individual die cut shapes available
• Pressure sensitive adhesive: single side (A1 suffix) or double side (A2 suffix)
• Fiberglass reinforcement available for sheet types

Ziitek is a high-tech enterprise specializing in thermal interface materials (TIMs) research, development, and manufacturing. With advanced production equipment and comprehensive testing capabilities, we provide effective thermal management solutions including thermal silicone pads, graphite sheets, double-sided tapes, and phase change materials. All products comply with UL94 V-0, SGS, and ROHS standards.