TIF500-30-11US CPU Thermal Pad 3.0 W/mK Conductivity 0.5-5.0mm Thickness for Electronics Cooling
TIF500-30-11US Series thermal pads are high-performance, cost-effective thermal interface materials designed to efficiently manage heat in electronic devices. These blue-colored ceramic-filled silicone rubber pads fill air gaps between heating elements and heat dissipation surfaces, enhancing thermal transfer and extending component lifespan.
3.0 W/mK thermal conductivity for efficient heat dissipation
Electrically isolating with dielectric breakdown voltage >5500 VAC
UL 94-V0 flame rating for enhanced safety
20 Shore 00 hardness with excellent flexibility and elasticity
| Property | Value |
|---|---|
| Product Name | TIF500-30-11US Series |
| Color | Gray |
| Construction | Ceramic filled silicone rubber |
| Specific Gravity | 2.9 g/cc |
| Operating Temperature | -40°C to 160°C |
| Hardness | 20 Shore 00 |
| Dielectric Breakdown Voltage | >5500 VAC |
| Flame Rating | UL 94-V0 |
| Dielectric Constant | 4.0 MHz |
| Thermal Conductivity | 3.0 W/mK |
| Available Thickness | 0.5mm to 5.0mm |
Standard thicknesses range from 0.25mm (0.010") to 5.08mm (0.200") with multiple intermediate options available. Consult factory for custom thickness requirements.
- 8" x 16" (203mm x 406mm)
- 16" x 18" (406mm x 457mm)
- Custom die-cut shapes available upon request
- Pressure Sensitive Adhesive: Single side (A1 suffix) or double side (A2 suffix)
- Reinforcement: Fiberglass reinforced sheets available
- Mass storage devices
- Handheld portable electronics
- Audio and video components
- GPS navigation and portable devices
- CD-Rom and DVD-Rom cooling
- Various electronic devices requiring thermal management
- Total quality control philosophy
- Free sample program available
- Confidentiality agreements and business secret contracts
- Competitive advantage product portfolio
Download the complete product datasheet for detailed specifications:
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