TIF500-30-11US CPU Thermal Pad 3.0 W/mK Conductivity 0.5-5.0mm Thickness for Electronics Cooling

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000 pcs
Delivery Time: 3-8 work days
Brand: Ziitek
Product Description
Product Overview

TIF500-30-11US Series thermal pads are high-performance, cost-effective thermal interface materials designed to efficiently manage heat in electronic devices. These blue-colored ceramic-filled silicone rubber pads fill air gaps between heating elements and heat dissipation surfaces, enhancing thermal transfer and extending component lifespan.

Key Features
Thermal Performance

3.0 W/mK thermal conductivity for efficient heat dissipation

Electrical Properties

Electrically isolating with dielectric breakdown voltage >5500 VAC

Safety & Compliance

UL 94-V0 flame rating for enhanced safety

Physical Properties

20 Shore 00 hardness with excellent flexibility and elasticity

Technical Specifications
Property Value
Product Name TIF500-30-11US Series
Color Gray
Construction Ceramic filled silicone rubber
Specific Gravity 2.9 g/cc
Operating Temperature -40°C to 160°C
Hardness 20 Shore 00
Dielectric Breakdown Voltage >5500 VAC
Flame Rating UL 94-V0
Dielectric Constant 4.0 MHz
Thermal Conductivity 3.0 W/mK
Available Thickness 0.5mm to 5.0mm
Available Thickness Options

Standard thicknesses range from 0.25mm (0.010") to 5.08mm (0.200") with multiple intermediate options available. Consult factory for custom thickness requirements.

Standard Sheet Sizes
  • 8" x 16" (203mm x 406mm)
  • 16" x 18" (406mm x 457mm)
  • Custom die-cut shapes available upon request
Customization Options
  • Pressure Sensitive Adhesive: Single side (A1 suffix) or double side (A2 suffix)
  • Reinforcement: Fiberglass reinforced sheets available
Applications
  • Mass storage devices
  • Handheld portable electronics
  • Audio and video components
  • GPS navigation and portable devices
  • CD-Rom and DVD-Rom cooling
  • Various electronic devices requiring thermal management
Quality Assurance
  • Total quality control philosophy
  • Free sample program available
  • Confidentiality agreements and business secret contracts
  • Competitive advantage product portfolio
TIF500-30-11US thermal pad product image showing blue thermal interface material
Technical Documentation

Download the complete product datasheet for detailed specifications:

Sample Requests

Contact us via website message, email, or phone to request customized samples for your specific application requirements.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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