Thermally Conductive Potting Compound

High-performance silicone potting compound featuring 3.5W/mK thermal conductivity and UL 94 V-0 fire resistance. Designed for LED lighting, transformers, and electronic device encapsulation with excellent heat dissipation, waterproof protection, and extended component lifetime. Available in 1KG, 5KG, and 25KG packaging options.

Two-component thermally conductive potting compound with 1.0W/mK thermal conductivity and low temperature curing. Features 30-minute pot life, UL94 V-0 fire resistance, excellent insulation properties, and wide operating temperature range from -40°C to 160°C. Ideal for LED lighting, transformers, capacitors, and electronic device protection.

TIS™680-12AB Series two-part silicone potting compound offers 1.2W/mK thermal conductivity with UL94 V-0 fire resistance. Features room temperature curing, excellent insulation, and flexible elasticity for capacitors, transformers, and LED applications. Operating temperature range -40℃ to 160℃ with 6000V/mm dielectric strength.

Two-component silicone potting compound with 2.8W/m-K thermal conductivity, UL 94 V-0 fire rating, and excellent electrical insulation. Ideal for LED lighting, power drivers, transformers, and electronic device encapsulation. Features low viscosity, water resistance, and extended component lifetime protection.

High Thermal Conductive 2.8W Two Component Potting Silicone Adhesive For Industrial Control TIG®680-28AB Series is a two-component high thermal conductivity silicone sealant with room temperature curing, long working time, and flame retardant properties. This product is particularly suitable for sealing capacitors and small electronic devices. Its excellent flexibility properties enable it to provide excellent cushioning protection for coating materials. The low viscosity

4.0W/MK High Thermal Conductive Two Component Potting Silicone Adhesive For Electronic Industry Heat Dissipation TIG®680-40AB Series is a two-component high thermal conductivity silicone sealant with room temperature curing, long working time, and flame retardant properties. This product is particularly suitable for sealing capacitors and small electronic devices. Its excellent flexibility properties enable it to provide excellent cushioning protection for coating materials.

Moisture Resistance 2.5W/MK One Component Silicone Thermal Conductive Adhesive For Household Appliance Components Company Profile Ziitek Technology Company is dedicated to providing a comprehensive range of thermal management products and services to meet various demand scenarios. Ziitek Technology offers prompt and flexible services. Our thermal conductive materials are widely used in the fields of new energy, electronic appliances, transportation, industry, healthcare,

Two-component silicone potting compound with 1.5 W/mK thermal conductivity and UL 94 V-0 fire resistance. Designed for LED power supplies, controllers, and electronic devices requiring efficient heat dissipation. Features low viscosity, excellent insulation, waterproof properties, and extended service temperature range from -40℃ to +160℃.

One-component room temperature cure silicone adhesive with 1.0W/mK thermal conductivity and UL94V-0 flame retardancy. Features excellent adhesion to metals, low shrinkage, and non-corrosive dealcoholized formulation. Ideal for LED heat sinks, power modules, and electronic component thermal management applications with 3-7 day cure time at 25℃.

TIS680-15AB two-component thermal potting adhesive offers 1.5W/mK conductivity with UL 94 V-0 fire resistance. Features low temperature curing, 30-minute pot life, and excellent insulation for LED lighting, transformers, and electronic device encapsulation. Available in 1KG, 5KG, and 10KG packaging options with free samples available.

Single-component thermally conductive silicone adhesive with 1.2W/mK thermal conductivity and UL94 V-0 rating. Features excellent electrical insulation, strong adhesion to metals, and operation temperature range of -60°C to 250°C. Ideal for LED cooling, power modules, and electronic component thermal management with 3-7 day cure time.