CPU Thermal Pad 1.5mm Thick Thermal Gap Pad For Heat Transfer In Electronic Components
CPU Thermal Pad 1.5mm Thick Thermal Gap Pad For Heat Transfer In Electronic Components
Company Profile
Ziitek Technology CO.,Ltd is a professional manufacturer of thermal interface materials with 20 years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste,thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel , silicone foam, silicone-free thermal pads etc.We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.
Products description
>Super soft and highly compliant
>Self-adhesive without the need for additional surface adhesives
>Good insulation performance
>Mass storage devices
>Automotive electronics
>Set top boxes
>Micro heat pipe thermal solutions
>Automotive engine control units
>Telecommunication hardware
>Power tools
>Network communication products
>Electric vehicle batteries
>Computer CPU/GPU Cooling
>New energy vehicle power systems
Key attributes
| Typical Properties of TIF®100-30-11US Series | |||
| Property | Value | Test method | |
| Colo | Dark Gray | Visual | |
| Construction & Compostion | Ceramic filled silicone elastomer | ****** | |
| Density(g/cm³) | 3.0 | ASTM D792 | |
| Thickness Range(inch/mm) | 0.010~0.020 | 0.030~0.200 | ASTM D374 |
| (0.25~0.50) | (0.75~5.00) | ||
| Hardness | 65 Shore 00 |
20 Shore 00 |
ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ****** | |
| Breakdown Voltage(V/mm) | ≥5500 | ASTM D149 | |
| Dielectric Constant @1MHz | 7.0 | ASTM D150 | |
| Volume Resistivity(Ohm-meter) | ＞1.0X1012 | ASTM D257 | |
| Flame rating | V-0 | UL 94 (E331100) | |
| Thermal conductivity (W/m-K) | 3.0 | ASTM D5470 | |
| 3.0 | ISO22007 | ||
Product Specifications
Standard Thickness:0.010" (0.25 mm)～0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).
The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Q: Do you provide samples ? is it free or extra cost?
A: Yes, we could offer samples free of charge.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.