Thermally Conductive CPU Thermal Pad Designed For In Electronic Devices To Improve Heat Transfer And Prevent Overheating Issues

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000 pcs
Delivery Time: 3-8 work days
Brand: Ziitek
Product Description

Thermally Conductive CPU Thermal Pad Designed For In Electronic Devices To Improve Heat Transfer And Prevent Overheating Issues


Company Profile


Ziitek Technology CO.,Ltd is a professional manufacturer of thermal interface materials with 20 years of industry experience. Integrating R&D, production, sales, and technical services, the company offers a comprehensive product line covering thermally conductive silicone pads, thermal conductive grease/paste,thermally conductive graphite sheets, phase change materials, thermally conductive plastics, thermal gel , silicone foam, silicone-free thermal pads etc.We adhere to strict quality standards and provide customized solutions based on customer requirements. Our products are widely used in electronics, new energy, telecommunications, industrial control, and other fields, earning the trust of customers both domestically and internationally through our proven capabilities.


Products description

TIF®1120-30-11US Series is an ultra-soft thermal interface material designed specifically to protect precision components that are extremely sensitive to mechanical stress. This product combines high thermal conductivity with exceptional gel-level softness,achieving a perfectly low-stress fit. It is suitable for addressing issues such as large tolerances, uneven surfaces, and the susceptibility of precision components to mechanical damage in high-precision assemblies.

Features 

>High thermal conductivity
>Super soft and highly compliant
>Self-adhesive without the need for additional surface adhesives
>Good insulation performance

Applications 

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>CD-Rom, DVD-Rom cooling

>LED Power Supply

>Power tools
>Network communication products
>Electric vehicle batteries
>Computer CPU/GPU Cooling
>New energy vehicle power systems


Key attributes 


Typical Properties of TIF®100-30-11US Series
Property Value Test method
Color Dark Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.0 ASTM D792
Thickness Range(inch/mm) 0.010~0.020 0.030~0.200 ASTM D374
(0.25~0.50) (0.75~5.00)
Hardness 65 Shore 00

20 Shore 00

ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant @1MHz 7.0 ASTM D150
Volume Resistivity(Ohm-meter) >1.0X1012  ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity (W/m-K) 3.0 ASTM D5470
3.0 ISO22007


Product Specifications 


Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm).
Standard Size: 16" X16" (406 mm X406 mm).


Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).


The TIF®series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

 

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Ziitek Culture


Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

Request A Quote

Please check your email address.
Your message must be at least 20 characters.