TIF1120-40-11US Thermal Conductive Silicone Pad For Memory Modules
Outstanding thermal performance TIF1120-40-11US thermal pad for Memory Modules
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
<Available in varies thicknesses
<Broad range of hardnesses available
<Moldability for complex parts
<Automotive engine control units
<Telecommunication hardware
<Handheld portable electronics
<Semiconductor automated test equipment (ATE)
<CPU
<display card
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Typical Properties of TIF1120-40-11US
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Product Name
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TIF1120-40-11US Series |
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Colour
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gray | ||
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Construction & Compostion
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Ceramic filled silicone elastomer
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Specific gravity |
3.15 g/cc
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Thickness |
3.0mmT
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Hardness
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20 Shore 00
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Dielectric constant@1MHz
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4.0 MHz
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Continuos Use Temp
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-40to 160℃
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Dielectric Breakdown Voltage
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>5500 VAC
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Thermal conductivity
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4.0 W/mK
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| Volume Resistiviyt |
6.0*1012 Ohm-cm |
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Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Independent R&D team
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FAQ
Q:How can we get detailed price list?
A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.