Ziitek TIF1180-30-06UF 4.5mm Thermal Gap Pad with 3.0 W/mK Conductivity for Memory Modules
Price:
0.1-10 USD/PCS
MOQ:
1000 pcs
Delivery Time:
3-8 work days
Brand:
Ziitek
Product Description
Product Overview
Ziitek TIF1180-30-06UF silicone thermal gap pads provide superior heat dissipation for memory modules and electronic components requiring efficient thermal management solutions.
Key Features
- High thermal conductivity: 3.0 W/mK
- Standard thickness: 4.5mm
- Low hardness: 75±5 Shore 00 for excellent conformability
- Naturally tacky surface eliminates need for additional adhesives
- White ceramic-filled silicone elastomer construction
- Excellent electrical isolation properties
- Available in multiple thicknesses from 0.51mm to 5.08mm
Technical Specifications
| Property | Value |
|---|---|
| Product Name | TIF1180-30-06UF Series |
| Color | White |
| Construction | Ceramic filled silicone elastomer |
| Specific Gravity | 3.0 g/cc |
| Thickness | 4.5mm |
| Hardness | 75±5 Shore 00 |
| Dielectric Constant @1MHz | 5.0 MHz |
| Continuous Use Temperature | -40 to 160℃ |
| Dielectric Breakdown Voltage | >5500 VAC |
| Thermal Conductivity | 3.0 W/mK |
| Volume Resistivity | 2.3×10¹³ Ohm-cm |
Applications
- Mainboards and motherboards
- Notebook computers
- Power supply units
- Heat pipe thermal solutions
- Memory modules
- Mass storage devices
Documentation
Product Images
Quality & Service Commitment
Ziitek Electronic Material and Technology Ltd. maintains rigorous quality standards with total quality control, precise manufacturing processes, and comprehensive team support to deliver exceptional thermal management solutions.
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Get in Touch
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Company
Dongguan Ziitek Electronical Material and Technology Ltd.
Location
No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person
Dana Dai