TIF1200-30-06UF Thermal Silicone Pad 5.0mm Thickness 3.0 W/mK Conductivity for Electronics Cooling

Price Negotiable

Price: 0.1-10 USD/PCS

MOQ: 1000 pcs

Delivery Time: 3-8 work days

Brand: Ziitek

Product Description

Product Overview

The TIF1200-30-06UF thermal silicone pad delivers exceptional thermal performance with 3.0 W/mK conductivity and 5.0mm thickness. This high-tack surface thermal pad reduces contact resistance while providing excellent moldability for complex electronic components.

Key Features

High thermal conductivity: 3.0 W/mK
Optimal thickness: 5.0mm
Shore 00 hardness: 75±5 for superior compliance
High tack surface reduces contact resistance
Outstanding thermal performance across temperature range
Excellent moldability for complex parts and surfaces

Technical Specifications

Property	Value
Product Name	TIF1200-30-06UF Series
Color	White
Construction & Composition	Ceramic filled silicone elastomer
Specific Gravity	3.0 g/cc
Thickness	5.0mm
Hardness	75±5 Shore 00
Dielectric Constant @1MHz	5.0 MHz
Continuous Use Temperature	-40 to 160℃
Dielectric Breakdown Voltage	>5500 VAC
Thermal Conductivity	3.0 W/mK
Volume Resistivity	2.3×10¹³ Ohm-cm

Applications

Automotive electronics
Set top boxes
Audio and video components
IT infrastructure
GPS navigation and portable devices
CD-Rom, DVD-Rom cooling systems
Routers and networking equipment

Documentation

Manufacturing Capabilities

Ziitek specializes in thermal interface materials including gap fillers, thermal pads, tapes, and conductive plastics. Our independent R&D team supports custom orders for dimensions, shapes, colors, and adhesive coatings.

Product Images