Moldability For Complex Parts Heat Sink Thermal Pad Conductive For It Infrastructure
-40 to 160℃ Moldability for Complex Parts Conductive Pads for IT Infrastructure
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
Ziitek TIF1120-10UF use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
<RoHS compliant
<UL recognized
<Fiberglass reinforced for puncture, shear and tear resistance
<Automotive electronics
<Set top boxes
<Audio and video components
<IT infrastructure
<GPS navigation and other portable devices
<CD-Rom, DVD-Rom cooling
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Typical Properties of TIF1120-10UF
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| Product Name | TIF1120-10UF Series | ||
| Colour | gray | ||
| Construction & Compostion | Ceramic filled silicone elastomer | ||
| Specific gravity | 2.2 g/cc | ||
| Thickness | 3.0mmT | ||
| Hardness | 75 Shore 00 | ||
| Dielectric constant@1MHz | 3.9 MHz | ||
| Continuos Use Temp | -40 to 160℃ | ||
| Dielectric Breakdown Voltage | >5500 VAC | ||
| Thermal conductivity | 1.5 W/mK | ||
| Volume Resistivity | 1.0*1012 Ohm-cm | ||
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.
Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.