1.5mmT Heat Sink Thermal Pad Silicone Based 0.5mm Thickness Thermal Interface Material For Thermal Management Of LED TV Components
TIF®160-20-10UF Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.
- Good thermal conductivity: 2.0 W/mK
- Thickness: 1.5mmT
- Hardness: 75 Shore 00
- Moldability for complex parts
- Soft and compressible for low-stress applications
- Naturally tacky, requiring no additional adhesive coating
- High-tack surface reduces contact resistance
- Automotive electronics
- Cooling components to the chassis or frame
- High-speed mass storage drives
- Heat sinking housing at LED-lit BLU in LCD
- LED TV and LED-lit lamps
- Handheld portable electronics
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Composition | Ceramic filled silicone elastomer | ZKTM J024 |
| Density (g/cm³) | 2.8 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.200 / 0.25~5.00 | ASTM D374 |
| Hardness (Shore 00) | 75 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200°C | ZKTM J025 |
| Breakdown Strength (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1MHz | 6.5 | ASTM D150 |
| Volume Resistivity (Ohm-cm) | >1.0×10¹² | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity (W/m-K) | 2.0 | ASTM D5470 |
| Thermal Conductivity (W/m-K) | 2.0 | ISO22007 |
Ziitek is a high-tech enterprise dedicated to the R&D, manufacture, and sales of thermal interface materials (TIMs). With rich experience in this field, we support customers with the latest, most effective, and one-step thermal management solutions. We operate many advanced production equipments, full test equipments, and fully automatic coating production lines, enabling the production of high-performance thermal silicone pads, thermal graphite sheets/films, thermal double-sided tape, thermal insulation pads, thermal ceramic pads, phase change materials, thermal grease, and more. Our products are UL94 V-0, SGS, and RoHS compliant.
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Q: Are you a trading company or a manufacturer?
A: We are a manufacturer in China and Vietnam.
Q: How long is your delivery time?
A: Generally 3–7 working days if the goods are in stock, or 7–10 working days if the goods are not in stock, depending on quantity.
Q: What is a Thermal Interface Material (TIM)?
A: Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases, and phase-change materials.
Q: What is thermal conductivity? Is higher thermal conductivity always better?
A: Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m·K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression, and contact area.
Q: What is thermal resistance in thermal interface materials?
A: Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.
Q: What is the difference between thermal conductivity and thermal resistance?
A: Thermal conductivity describes the intrinsic heat-conduction capability of a material, while thermal resistance also depends on thickness, contact area, and interface conditions.
Q: Does higher thermal conductivity always mean better cooling?
A: Not necessarily. Thickness, interface contact, compression, and actual thermal resistance can significantly affect final cooling performance.
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