Heat Sink Thermal Pad Featuring High Tack Surface And 3.5mm Thickness For Optimal Thermal Management In Mainboard/mother Board
The TIF®1140-20-10UF Series is a structurally supportive thermal pad designed to deliver reliable heat dissipation while ensuring mechanical support and durability. It effectively fills interface gaps, transfers heat, and provides mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications requiring a balance between heat dissipation, insulation, and mechanical stability.
- Good thermal conductivity
- Good softness and fillability
- Self-adhesive without the need for additional surface adhesives
- Good insulation performance
- Cooling components to the chassis or frame
- High-speed mass storage drives
- Heat sinking housing at LED-lit BLU in LCD
- LED TV and LED-lit lamps
- RDRAM memory modules
- Micro heat pipe thermal solutions
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ZKTM J024 |
| Density (g/cm³) | 2.8 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.200 / 0.25~5.00 | ASTM D374 |
| Hardness (Shore OO) | 75 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200°C | ZKTM J025 |
| Breakdown Strength (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1MHz | 6.5 | ASTM D150 |
| Volume Resistivity (Ohm-cm) | >1.0×10¹² | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity (W/m-K) | 2.0 | ASTM D5470 |
| Thermal Conductivity (W/m-K) | 2.0 | ISO 22007 |
Ziitek, founded in 2006 and headquartered in Dongguan, Guangdong Province, is a high-tech enterprise focusing on heat conduction, heating, sealing, and EMI. The company operates production bases in Kunshan, Taiwan Province, and Vietnam, with a global layout ensuring efficient delivery. Adhering to the concept of "resource sharing and joint development," Ziitek discusses future technology and application design requirements with customers from the research and development stage, providing solutions ranging from thermal interface materials to EMI shielding, heating products, seals, and thermal engineering plastics. The products have passed certifications including IATF16949 and ISO9001, and meet ROHS, REACH, and UL specifications, helping customers create greater value in fields such as new energy, AI, 5G, and aerospace.
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A: All data in the sheet are actual tested results. Hot Disk and ASTM D5470 are utilized to test thermal conductivity.
A: A thermal silicone pad is a pre-formed TIM typically made of a silicone-based material and thermally conductive fillers. It is designed to fill gaps between heat sources and heat sinks. Depending on the product formulation, thermal silicone pads can also provide electrical insulation.
A: Key advantages include easy installation, controlled thickness, good flexibility, and effective gap-filling capability. Depending on the application, thermal silicone pads can also be designed with different levels of thermal conductivity, hardness, flame resistance, and electrical insulation.
A: Not necessarily. If the pad is too thin to adequately fill the actual gap, proper interface contact may not be achieved. The appropriate thickness should be selected based on the actual structural tolerances and application requirements.
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