RoHS Compliant Heat Sink Thermal Pad Suitable For Heat Pipe Thermal Solutions With Excellent Electrical Insulation Properties
The TIF® 1160-20-10UF Series is a structurally supportive thermal pad designed to deliver effective heat dissipation while ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and provides mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.
- Good thermal conductivity
- Good softness and fillability
- Self-adhesive without the need for additional surface adhesives
- Good insulation performance
- Cooling components to the chassis of frame
- High-speed mass storage drives
- Heat sinking housing at LED-lit BLU in LCD
- LED TV and LED-lit lamps
- RDRAM memory modules
- Micro heat pipe thermal solutions
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ZKTM J024 |
| Density (g/cm³) | 2.8 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.200 / 0.25~5.00 | ASTM D374 |
| Hardness (Shore OO) | 75 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200°C | ZKTM J025 |
| Breakdown Strength (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1MHz | 6.5 | ASTM D150 |
| Volume Resistivity (Ohm-cm) | >1.0×10¹² | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity (W/m-K) | 2.0 | ASTM D5470 |
| Thermal Conductivity (W/m-K) | 2.0 | ISO 22007 |
- With PET film or foam for protection
- Use paper card to separate each layer
- Export carton inside and outside
- Meet customers' requirements — customized
Quantity (Pieces): 5000
Estimated Time (days): To be negotiated
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Q: Do you accept custom orders?
A: Yes, we welcome custom orders. Our custom elements include dimension, shape, color, and coating on one side or two sides with adhesive or fiberglass. If you want to place a custom order, please kindly offer a drawing or leave your custom order information.
Q: What is a Thermal Interface Material (TIM)?
A: TIM (Thermal Interface Material) refers to a class of materials used to fill microscopic air gaps between a heat source and a heat sink. TIMs help reduce interface thermal resistance and improve heat transfer from the heat source to the cooling structure. Common TIMs include thermal pads, thermal gels, thermal greases, phase change materials (PCMs), and liquid metal.
Q: What is Thermal Conductivity?
A: Thermal conductivity indicates a material's ability to conduct heat and is typically measured in W/m·K. Under the same testing conditions, a higher thermal conductivity generally indicates better heat-conduction capability.
Q: What is Thermal Resistance?
A: Thermal resistance indicates the resistance to heat flow through a material or interface and is typically expressed in K/W or °C/W. Lower thermal resistance generally means that heat can pass through the material more efficiently.
Q: What is the difference between Thermal Conductivity and Thermal Resistance?
A: Thermal conductivity primarily reflects the intrinsic heat-conduction capability of a material, while thermal resistance is also affected by factors such as thermal conductivity, material thickness, contact area, and interface conditions. In practical applications, it is important to consider not only thermal conductivity but also the overall thermal resistance of the TIM layer.
Ziitek is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically and thermally conductive interface pads, thermal grease, thermal conductive plastic, silicone rubber, silicone foams, and phase changing materials products, with well-equipped testing equipment and strong technical force.
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