5.0mmT Heat Sink Thermal Pad Offering Thermal Conductivity For In Mainboards VGA Cards Notebooks And LED Lighting Applications
The 5.0mmT Heat Sink Thermal Pad delivers reliable thermal conductivity for mainboards, VGA cards, notebooks, and LED lighting applications. Designed to fill interface gaps and transfer heat efficiently, it also provides structural support and durability for stacked components.
Ziitek is a high-tech enterprise dedicated to the R&D, manufacture, and sales of thermal interface materials (TIMs). With extensive experience in this field, we support customers with the latest, most effective, one-step thermal management solutions.
We operate many advanced production equipments, full test equipments, and fully automatic coating production lines. These support the production of high-performance thermal silicone pads, thermal graphite sheets/films, thermal double-sided tape, thermal insulation pads, thermal ceramic pads, phase change materials, thermal grease, and more. Our products are UL94 V-0, SGS, and ROHS compliant.
The TIF®120-20-10UF Series is a structurally supportive thermal pad designed to provide good heat dissipation while also ensuring structural support and durability. It reliably fills interface gaps, transfers heat, and offers mechanical support for stacked components, resisting compressive deformation. This product is an ideal choice for applications that require a balance between heat dissipation, insulation, and mechanical stability.
- Good thermal conductivity
- Good softness and fillability
- Self-adhesive without the need for additional surface adhesives
- Good insulation performance
- Cooling components to the chassis of frame
- High speed mass storage drives
- Heat sinking housing at LED-lit BLU in LCD
- LED TV and LED-lit lamps
- RDRAM memory modules
- Micro heat pipe thermal solutions
| Property | Value | Test Method |
|---|---|---|
| Color | Gray | Visual |
| Construction & Composition | Ceramic filled silicone elastomer | ZKTM J024 |
| Density (g/cm³) | 2.8 | ASTM D792 |
| Thickness Range (inch/mm) | 0.010~0.200 / 0.25~5.00 | ASTM D374 |
| Hardness (Shore OO) | 75 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200°C | ZKTM J025 |
| Breakdown Strength (V/mm) | ≥5500 | ASTM D149 |
| Dielectric Constant @1MHz | 6.5 | ASTM D150 |
| Volume Resistivity (Ohm-cm) | >1.0×10¹² | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity (W/m-K) | 2.0 | ASTM D5470 |
| Thermal Conductivity (W/m-K) | 2.0 | ISO22007 |
- Our value message is “Do it right the first time, total quality control.”
- Our core competency is thermal conductive interface materials.
- Competitive advantage products.
- Confidentiality agreement and business secret contract.
- Free sample offer.
- Quality assurance contract.
A: We are a manufacturer in China / Vietnam.
A: Generally it is 3-7 work days if the goods are in stock, or 7-10 work days if the goods are not in stock. It depends on quantity.
A: Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases, and phase-change materials.
A: Thermal conductivity measures a material’s ability to conduct heat and is typically expressed in W/m·K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression, and contact area.
A: Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.
A: Thermal conductivity describes the intrinsic heat-conduction capability of a material, while thermal resistance also depends on thickness, contact area, and interface conditions.
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