Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Ziitek TIF2160-20-02ES is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

<Moldability for complex parts
<Outstanding thermal performance
<High tack surface reduces contact resistance

<cooling components to the chassis of frame

<High speed mass storage drives

<Heat Sinking Housing at LED-lit BLU in LCD

<LED TV and LED-lit lamps

<RDRAM memory modules

<Micro heat pipe thermal solutions

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.