Chemicals Adhesives & Sealants

TIE™280-12AB Thermal Conductive Epoxy Adhesive - 1.2W/mK Thermal Conductivity, 45 Minute Working Time

Price Negotiable
Price: 1-100USD/kg
MOQ: 10kg
Delivery Time: 3-8 work days
Brand: Ziitek
Product Description
TIE™280-12AB Thermal Conductive Epoxy Adhesive
Two-component, high thermal conductivity epoxy resin potting compound with 1.2W/mK thermal performance, room-temperature curing, and fireproof properties. Ideal for capacitors and small electronic devices requiring reliable thermal management.
Product Features
  • Outstanding thermal performance: 1.2W/mK
  • High tack surface reduces contact resistance
  • RoHS compliant and UL recognized
  • Fiberglass reinforced for puncture, shear and tear resistance
  • Easy release construction
  • Long working time: 45 minutes at 25℃
Applications
  • Heat pipe thermal solutions
  • Memory modules and mass storage devices
  • Automotive electronics
  • Set top boxes and audio/video components
  • IT infrastructure
  • GPS navigation and portable devices
Technical Specifications
Property Value Test Method
Thermal Conductivity 1.2 W/m-K ASTM D5470
Hardness 85 Shore D ASTM 2240
Continuous Use Temperature -40 to 160℃ Manufacturer Standard
Tensile Strength (Al/Al @25°C) >10,000 psi Manufacturer Standard
Heat Capacity 0.7 J/g-K ASTM C351
Operating Time @25℃ 45 Minutes Manufacturer Standard
Curing Procedures
Curing Temperature Curing Time
25℃ 3 Hours
70℃ 30 Minutes
Packaging Options
Available in 1KG A/B sets, 5KG A/B sets, and 10KG A/B sets.
Documentation
TIE280-12AB Thermal Conductive Epoxy Adhesive product packaging and application examples

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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