TIS100-01 Thermal Silicone Pad 0.15-0.45mm Thickness with 1.0W/mK Conductivity for GPU CPU IGBT Cooling

Price Negotiable
Price: 0.1-10 USD/pcs
MOQ: 1000pcs
Delivery Time: 3-6 work days
Brand: Ziitek
Product Description
High-Performance Thermal Silicone Pad Overview
TIS100-01 Series thermal silicone pads provide exceptional thermal conductivity and electrical insulation for demanding electronic applications. These ceramic-filled silicone elastomer sheets deliver reliable heat dissipation while maintaining high dielectric strength.
Thermal silicone pad product overview
Key Product Features
  • Highly compliant surface with superior thermal conductivity
  • High dielectric strength for electrical insulation
  • Low thermal resistance with excellent voltage isolation
  • Enhanced resistance to tears and punctures
  • Thermal conductivity of 1.0W/mK for efficient heat transfer
  • Dielectric breakdown voltage exceeding 3500VAC
Technical Specifications
Property Value Test Method
Thickness Range 0.15mm - 0.45mm ASTM D374
Specific Gravity 2.06 g/cc ASTM D297
Tensile Strength 425 Kpsi ASTM D412
Operating Temperature -45°C to 180°C -
Dielectric Breakdown >3500VAC ASTM D149
Volume Resistivity >4×10¹² Ohm-cm ASTM D257
Thermal Conductivity 1.0W/mK ISO22007.2.2
Flame Rating 94 V0 UL E331100
Available Thickness Options
  • TIS 106-01: 0.15mm thickness
  • TIS 108-01: 0.20mm thickness
  • TIS 109-01: 0.23mm thickness
  • TIS 110-01: 0.25mm thickness
  • TIS 112-01: 0.30mm thickness
  • TIS 118-01: 0.45mm thickness
Standard Dimensions & Customization
Standard sheet size: 12" x 160' (304mm x 48.76M). We offer individual die-cut shapes and custom thickness options to meet specific application requirements. Products are available with fiberglass reinforcement (designated by "FG" suffix).
Thermal silicone pad technical specifications
Primary Applications
  • Power conversion equipment and semiconductors
  • MOSFETs and IGBT power packages
  • Audio and video component cooling
  • Automotive control units and motor controllers
  • General high-pressure thermal interfaces
Documentation & Support
Download detailed technical specifications:
Packaging & Lead Time
Products are protected with PET film or foam, separated by paper card layers, and packed in export cartons. Custom packaging available upon request. Lead time for 5000 pieces: negotiable based on requirements.
Thermal silicone pad packaging and handling
Manufacturer Profile
Ziitek Electronic Material and Technology Ltd. specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. We offer customized products, full product lines, and flexible production capabilities to meet diverse thermal engineering requirements.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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