TIC800A-AL Phase Change Thermal Pad 2.5 W/mK Conductivity, 0.005-0.020" Thickness for Electronics Cooling

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000pcs
Delivery Time: 3-6 work days
Brand: Ziitek
Product Description
Product Overview

TIC™800A-AL series is a low melting point thermal interface material designed for electronic components. At 50°C, the material begins to soften and flow, filling microscopic irregularities between thermal solutions and integrated circuit packages to effectively reduce thermal resistance.

Key Performance Features
  • Ultra-low thermal resistance of 0.021°C-in²/W
  • Naturally tacky at room temperature - no adhesive required
  • No heat sink preheating needed for installation
  • Maintains thermal performance after 1,000 hours at 130°C
  • Withstands 500 thermal cycles from -25°C to 125°C
  • Minimal migration (pump out) at operating temperatures
Technical Specifications
Property TIC™805A-AL TIC™808A-AL TIC™810A-AL TIC™820A-AL Test Method
Color Gray/Silver Gray/Silver Gray/Silver Gray/Silver Visual
Thickness 0.005" (0.126mm) 0.008" (0.203mm) 0.010" (0.254mm) 0.020" (0.508mm) Standard Measurement
Thickness Tolerance ±0.0008" (±0.019mm) ±0.0008" (±0.019mm) ±0.0012" (±0.030mm) ±0.0020" (±0.050mm) Standard Measurement
Thermal Impedance @ 50 psi 0.063°C-in²/W (0.40°C-cm²/W) 0.08°C-in²/W (0.52°C-cm²/W) 0.097°C-in²/W (0.63°C-cm²/W) 0.157°C-in²/W (1.13°C-cm²/W) ASTM D5470 (modified)

Thermal Conductivity: 2.5 W/mK (ASTM D5470 modified)

Temperature Range: -25°C to 125°C

Phase Change Softening Temperature: 50°C-60°C

Density: 2.5 g/cc (Helium Pycnometer)

Applications
  • Power conversion equipment
  • Power semiconductors: TO packages, MOSFETs & IGBTs
  • Audio and video components
  • Automotive control units
  • Motor controllers
  • General high pressure interface applications
Product Configuration

Standard Thicknesses: 0.005" (0.127mm), 0.008" (0.203mm), 0.010" (0.254mm), 0.020" (0.508mm)

Standard Sizes: 10" x 16" (254mm x 406mm)

TIC800A-AL series are supplied with white release paper and bottom liner. Available in kiss cut with extended pull tab liner or individual die cut shapes.

Note: Pressure sensitive adhesive is not applicable for TIC800A-AL series products. No reinforcement is necessary.

Documentation & Support

TIC800A-AL Phase Change Thermal Interface Material Ziitek Thermal Materials R&D Laboratory

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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