High Temperature Resistance Thermal Conductive Double Sided Adhesive Tape from Ziitek Electronic Material and Technology Ltd. provides effective thermal management solutions for electronic equipment experiencing excessive heat generation that impacts performance.

The TIA™600 Series is specifically designed for bonding heat dissipation fins, microprocessors, and power consumption semiconductors. This adhesive tape delivers exceptional bonding strength with low thermal impedance, effectively replacing traditional methods like lubricating grease and mechanical fasteners.

• Thermal Conductivity: 0.8W/mK
• High bond strength to various surfaces with double-sided pressure sensitive adhesive
• High performance thermally conductive acrylic adhesive formulation

• Securing radiators to packaged chips
• Mounting radiators to power supply circuits or vehicle control circuit boards
• Replacement for hot melt glue, screws, fasteners, and other traditional fixing methods

• TIA605: 0.005" (0.127mm)
• TIA606: 0.006" (0.152mm)
• TIA608: 0.008" (0.203mm)
• TIA610: 0.010" (0.254mm)
• TIA612: 0.012" (0.304mm)
• TIA615: 0.015" (0.381mm)
• TIA620: 0.020" (0.508mm)

40" x 100" (106mm x 30.48M). Individual die cut shapes available upon request. TIA600 series roll types can be supplied with fiberglass film reinforcement.

Ziitek maintains rigorous quality control standards with a focus on precision manufacturing, timely delivery, and comprehensive customer support through integrated teamwork across sales, marketing, engineering, R&D, manufacturing, and logistics departments.