Machinery Refrigeration & Heat Exchange Equipment Refrigeration & Heat Exchange Parts

TIC™800G Series Phase Change Thermal Interface Material - 5.0 W/mK Conductivity, 0.005-0.012" Thickness Options

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000pcs
Delivery Time: 3-6 work days
Brand: Ziitek
Product Description
TIC™800G Series Phase Change Thermal Interface Material
Ziitek Electronic Material and Technology Ltd. specializes in developing advanced composite thermal solutions and manufacturing superior thermal interface materials. Our extensive experience enables us to provide optimal support in thermal engineering applications, offering customized products, comprehensive product lines, and flexible production capabilities.
Product Overview
The TIC™800G Series is a low melting point thermal interface material that begins softening at 50°C, flowing to fill microscopic irregularities between thermal solutions and integrated circuit packages. This phase change action significantly reduces thermal resistance while maintaining flexibility at room temperature without requiring reinforcing components that compromise thermal performance.
Performance & Reliability
The TIC™800G Series demonstrates exceptional durability with no thermal performance degradation after 1,000 hours at 130°C or after 500 thermal cycles from -25°C to 125°C. The material softens without fully changing state, resulting in minimal migration (pump out) at operating temperatures.
TIC800G Series Phase Change Thermal Interface Material sample
Key Features
  • 0.014℃-in²/W thermal resistance
  • Naturally tacky at room temperature, no adhesive required
  • No heat sink preheating required
Applications
  • High Frequency Microprocessors
  • Notebook and Desktop PCs
  • Computer Servers
  • Memory Modules
  • Cache Chips
  • IGBTs
Technical Specifications
Product Name TIC™805G TIC™808G TIC™810G TIC™812G Test Method
Color Gray Gray Gray Gray Visual
Thickness 0.005" (0.127mm) 0.008" (0.203mm) 0.010" (0.254mm) 0.012" (0.305mm)
Thickness Tolerance ±0.0005" (±0.127mm) ±0.0008" (±0.203mm) ±0.0010" (±0.0254mm) ±0.0012" (±0.0305mm)
Density 2.6g/cc Helium Pycnometer
Temperature Range -40℃~125℃
Phase Change Softening Temperature 50℃~60℃
Thermal Conductivity 5.0 W/mK ASTM D5470 (modified)
Thermal Impedance @ 50 psi (345 KPa) 0.014℃-in²/W (0.09℃-cm²/W) 0.020℃-in²/W (0.13℃-cm²/W) 0.038℃-in²/W (0.25℃-cm²/W) 0.058℃-in²/W (0.37℃-cm²/W) ASTM D5470 (modified)
Available Thicknesses
0.005" (0.127mm), 0.008" (0.203mm), 0.010" (0.254mm), 0.012" (0.305mm) - Custom thicknesses available upon request
Standard Sizes
10" x 16" (254mm x 406mm), 16" x 400' (406mm x 121.92M)
Supplied with white release paper and bottom liner. Available in kiss cut with extended pull tab liner or individual die cut shapes.
Packaging & Lead Time
Packaging includes PET film or foam protection, paper card separation between layers, and export cartons. Custom packaging available to meet specific requirements.
Lead time for 5,000 pieces: To be negotiated
Ziitek Electronic Material R&D laboratory and manufacturing facility
Ordering Information
To place an order, click the "Send messages" button and complete the message form with your product questions and purchase requirements. Our team will respond promptly via email or online communication.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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