Z-Paster100-30-10F Thermal Conductive Silicone-Free Gap Filler Pad - 3.0 W/mK, 0.5mm-5.0mm Thickness for Battery Packs
Z-Paster100-30-10F Series is a high-performance, silicone-free thermal conductive gap filler pad designed for battery pack applications and electronic cooling systems. This material fills air gaps between heating elements and heat dissipation components, enhancing thermal transfer efficiency and extending the lifespan of electronic devices.
- Silicone-free formulation for compatibility with sensitive applications
- Excellent thermal conductivity: 3.0 W/mK
- ROHS compliant for environmental safety
- Soft and compressible design for low-stress applications
- Available in various thicknesses from 0.5mm to 5.0mm
- Good dielectric properties with breakdown voltage >5000 VAC
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 3.0 W/mK | ASTM D5470 |
| Hardness | 65 Shore 00 | ASTM 2240 |
| Specific Gravity | 2.88 g/cc | ASTM D297 |
| Thickness Range | 0.5mm - 5.0mm | ASTM D374 |
| Dielectric Breakdown Voltage | >5000 VAC | ASTM D149 |
| Continuous Use Temperature | -20°C to 125°C | - |
| Flame Rating | 94 V0 | Equivalent to |
- Battery pack thermal management
- Automotive electronics cooling
- IT infrastructure and data storage devices
- LED power supply systems
- Audio/video components and set-top boxes
- GPS navigation and portable devices
Ziitek is a high-tech enterprise specializing in thermal interface materials R&D, manufacturing, and sales. Our facilities include advanced production equipment, full testing capabilities, and automated coating production lines. All products comply with UL94 V-0, SGS, and ROHS standards.
Available in standard thicknesses from 0.5mm to 5.0mm. Proprietary NS1 option available to eliminate tack from one side for improved handling during installation.
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