TIS100-10 Series High Temperature Silicone Thermal Insulation Pads 0.25mm-4.0mm Thickness 1.0 W/mK Conductivity

Price Negotiable

Price: 0.1-10 USD/pcs

MOQ: 1000pcs

Delivery Time: 3-6 work days

Brand: Ziitek

Product Description

High Temperature Silicone Thermal Insulation Pads

TIS™100-10 Series high-efficiency insulation materials combine thermal conduction properties with excellent dielectric strength. These ceramic-filled silicone elastomer pads with fiberglass reinforcement provide optimal performance for demanding electronic applications.

Key Features

High thermal conductivity (1.0 W/mK) with dielectric strength
Low thermal resistance with high voltage isolation (>10,000 Vac)
Easy release construction for simplified installation
Electrically isolating properties for circuit protection
High durability and flame rating 94 V0 compliance
Continuous operating temperature range: -45°C to 200°C

Applications

Telecommunication hardware and portable electronics
Semiconductor automated test equipment (ATE)
CPU, display card, and motherboard thermal management
Power supply units and heat pipe thermal solutions
Memory modules and mass storage devices
Automotive electronics and industrial systems

Technical Specifications

Property	TIS110-10	TIS180-10	TIS1160-10	Test Method
Composite Thickness	0.25mm	2.0mm	4.0mm	ASTM D374
Specific Gravity	1.85g/cc (ASTM D297)
Tensile Strength	20kg/cm² (ASTM D412)
Dielectric Breakdown Voltage	>10,000 Vac (ASTM D149)
Volume Resistivity	4.0×10¹³ Ohm-meter (ASTM D257)
Thermal Conductivity	1.0 W/mK (ASTM D5470)

Available Configurations

Standard thicknesses: 0.25mm, 2.0mm, 4.0mm
Pressure sensitive adhesive options: One side (A1 suffix) or double side (A2 suffix)
Standard sheet size: 304mm × 48.76M (12" × 160")
Custom die-cut shapes available upon request