Thermal Conductive Pad Designed To Fill Uneven Surfaces And Provide Thermal Interface For Heat Dissipation In Electronics

Founded in 2006 and headquartered in Dongguan, Guangdong, Ziitek is a high-tech enterprise specializing in heat conduction, heating, sealing and EMI products. The company has established production bases in Kunshan, Jiangsu, Taiwan Province and Vietnam to ensure efficient delivery and localized services globally.

Ziitek's product system covers thermal interface materials, EMI shielding, heating products, foamed silicone seals and thermal engineering plastics, widely used in new energy vehicles, energy storage, AI servers, 5G communications, aerospace and other fields. The company holds IATF16949 and ISO9001 certifications, with products meeting ROHS, REACH and UL specifications.

TIF^®100-30-15E Series is a well-balanced, general-purpose thermal pad offering good thermal conductivity and moderate hardness. This balanced design provides excellent surface conformity and ease of use, effectively transferring heat and providing basic physical protection for electronic components. Ideal for medium to high power heat dissipation needs, achieving optimal balance between cost and performance.

• Good thermal conductivity
• Moldability for complex parts
• Soft and compressible for low stress applications
• Naturally tacky, no additional adhesive coating required
• High tack surface reduces contact resistance

• Cooling components to chassis or frame
• High speed mass storage drives
• GPS navigation and portable devices
• LED TV and LED-lit lamps
• RDRAM memory modules
• Display cards
• Motherboards
• Notebook computers
• Routers
• AI servers
• Medical equipment
• Unmanned aerial vehicles (UAV)
• Robots
• Wireless chargers

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)

Standard Size: 16"×16" (406 mm×406 mm)

Reinforcement Fabric: FG (Fiberglass)

Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)

Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)

The TIF® series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.

Packaging:

• PET film or foam for protection
• Paper card to separate each layer
• Export carton inside and outside
• Customized packaging available to meet customer requirements

Lead Time: For quantity of 5000 pieces, estimated time to be negotiated

A: We are a manufacturer with facilities in China and Vietnam.

A: Generally 3-7 work days for in-stock goods, or 7-10 work days for non-stock items, depending on quantity.

A: Start with heat source power, gap thickness, target thermal resistance, operating temperature, contact area, assembly pressure, electrical insulation, flame resistance and reliability requirements.

A: ZIITEK focuses on thermal management materials and solutions for electronics. Our portfolio includes thermal pads, thermal gels and other thermal management materials, with solutions matched to gap, thermal performance, thickness, hardness, electrical insulation and reliability requirements.