Thermal Gap Filler Silicone Pad Providing Thermal Conductivity Of 3.0W/mK For 5G, Aerospace And AI
TIF®️100-50-01S Series is a well-balanced, general-purpose thermal pad offering excellent thermal conductivity and moderate hardness. This balanced design provides both superior surface conformity and ease of use, effectively transferring heat while providing basic physical protection for electronic components. Ideal for medium to high power heat dissipation applications, achieving optimal balance between cost and performance.
- High thermal conductivity
- Excellent softness and fillability
- Self-adhesive without additional surface adhesive
- Flame retardant safety
- Semiconductor automated test equipment (ATE)
- CPU cooling solutions
- Display card thermal management
- Motherboard thermal interface
- Power Electronics
- Consumer Electronics
- Industrial Control
- New Energy
- Electric Vehicle, Electronic Products
- Energy Storage, Industrial
- Lighting Equipment, Medical
- Netcom, Panel, Power Electronics
- Robot, Servers, Smart Home, Telecom
| Property | Value | Test Method |
|---|---|---|
| Color (Silicone Cloth/Silicone) | Black | Visual |
| Construction | Ceramic filled silicone elastomer | ZKTM J024 |
| Density (g/cm³) | 3.2 | ASTM D792 |
| Thickness Range | 0.010" ~0.020"(0.25mm~0.50mm) / 0.030"~0.200" (0.75~5.00mm) | ASTM D374 |
| Hardness (Shore 00) | 65 | 45 | ASTM 2240 |
| Recommended Operating Temperature | -40 to 200℃ | ZKTM J025 |
| Dielectric Constant @1MHz | 8.1 | ASTM D150 |
| Volume Resistivity (Ohm-meter) | ＞1.0×10¹² | ASTM D257 |
| Flame Rating | V-0 | UL 94 (E331100) |
| Thermal Conductivity (W/m-K) | 5.0 | ASTM D5470 |
Standard Thickness: 0.010" (0.25 mm) ~ 0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"×16" (406 mm × 406 mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass)
Coating Options: NS1 (Non-adhesive treatment), DC1 (Single-sided hardening)
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive)
The TIF®️ series is available in custom shapes and various forms. For other thicknesses or more information, please contact us.
We are a manufacturer with facilities in China and Vietnam.
Generally 3-7 work days for in-stock items, or 7-10 work days for non-stock items, depending on quantity.
Thermal Interface Materials (TIMs) are used to fill microscopic air gaps between a heat source and a heat sink, reducing interface thermal resistance and improving heat transfer efficiency. Common TIMs include thermal pads, thermal gels, thermal greases and phase-change materials.
Thermal conductivity measures a material's ability to conduct heat and is typically expressed in W/m*K. Higher thermal conductivity generally indicates better heat conduction, but actual thermal performance also depends on thickness, interface resistance, compression and contact area.
Thermal resistance represents the resistance to heat flow through a material or interface. For TIM applications, actual thermal resistance can be more meaningful than thermal conductivity alone.
Yes. Thermal silicone pads can be used between GPUs, CPUs, memory modules, power modules, and other heat-generating components and their corresponding cooling structures. They are commonly considered for thermal management in high-performance computing systems.
First, measure the actual gap and its tolerance range. Then consider the material's compression characteristics, required assembly pressure, and target thermal resistance when selecting the thickness. Sample testing under actual application conditions is generally recommended to validate the final solution.
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