Violet Thermal Pad 2.6 W/mK Thermal Conductivity with 0.25mm-5.0mm Thickness Range for Electronics Cooling

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000pcs
Delivery Time: 3-5 work days
Brand: Ziitek
Product Description
Ziitek Electronic Material and Technology Ltd. specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. Our extensive experience enables us to provide optimal support in thermal engineering applications, offering customized products, comprehensive product lines, and flexible production capabilities.
TIF 500 Series Thermal Interface Materials
The TIF 500 Series thermally conductive interface materials are designed to fill air gaps between heating elements and heat dissipation components. Their flexibility and elasticity make them ideal for coating uneven surfaces, effectively transferring heat to metal housings or dissipation plates from heat-generating electronic components, thereby enhancing efficiency and extending component lifespan.
Violet thermal pad sample showing material texture and color
Key Features
  • Excellent thermal conductivity (2.6 W/mK)
  • Available in multiple thickness options
  • Broad range of hardness specifications
  • Moldable for complex component shapes
  • Outstanding thermal performance characteristics
Primary Applications
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
  • Automotive engine control units
  • Telecommunication hardware systems
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
  • CPU cooling applications
  • Display card thermal management
  • Motherboard thermal interface solutions
Technical Specifications
Property Value Test Method
Color Violet Visual
Construction Ceramic filled silicone elastomer **********
Thermal Conductivity 2.6 W/mK ASTM D5470
Hardness 35 Shore 00 ASTM 2240
Specific Gravity 2.95g/cc ASTM D297
Thickness Range 0.010"-0.200" (0.25mm-5.0mm) ASTM D374
Dielectric Breakdown Voltage (T=1mm) >55000 VAC ASTM D149
Dielectric Constant 5.0 MHz ASTM D150
Volume Resistivity 5.3X10¹² Ohm-meter ASTM D257
Continuous Use Temperature -40 to 160 ℃ **********
Outgassing (TML) 0.45% ASTM E595
Flame Rating 94 V0 UL E331100
Available Thickness Options
Standard thicknesses range from 0.020" (0.51mm) to 0.200" (5.08mm) in various increments. Contact our factory for alternative thickness requirements.
Standard Sheet Sizes
8" x 16" (203mm x 406mm) and 16" x 18" (406mm x 457mm). Individual die-cut shapes available upon request.
Adhesive Options
Pressure-sensitive adhesive available: "A1" suffix for single-side adhesive, "A2" suffix for double-side adhesive.
Reinforcement Features
TIF series sheets can be supplied with fiberglass reinforcement for enhanced structural integrity.
Thermal pad technical diagram showing material structure and application
Packaging & Lead Time
Packaging includes PET film or foam protection, paper card separation between layers, and export-grade cartons. Custom packaging available. Lead time varies by quantity - contact for specific delivery estimates.
Manufacturing Capabilities
Ziitek specializes in thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive interface pads, thermal grease, thermal conductive plastic, silicone rubber, silicone foams, and phase changing materials.

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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