Chemicals Adhesives & Sealants

TIF500-50-11US Grey Silicone Thermal Pad 5 W/mK for 5G AI Projects, 0.5mm to 5.0mm Thickness

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000 pcs
Delivery Time: 3-8 work days
Brand: Ziitek
Product Description
Product Overview

TIF500-50-11US Series grey silicone thermal pads are engineered for high-performance thermal management in demanding 5G and artificial intelligence applications. These ceramic-filled silicone rubber pads effectively fill air gaps between heat-generating components and heat dissipation surfaces.

Key Features
Thermal Performance

5 W/mK thermal conductivity ensures efficient heat transfer from electronic components to cooling systems.

Material Properties

Naturally tacky surface requires no additional adhesive • 20 Shore 00 hardness for low stress applications • -40 to 160℃ continuous operating temperature range

Design Flexibility

Available in thicknesses from 0.5mm to 5.0mm • Custom die-cut shapes available • Optional pressure-sensitive adhesive on one or both sides

Technical Specifications
Property Value
Product Name TIF500-50-11US Series
Color Gray
Construction Ceramic filled silicone rubber
Specific Gravity 3.0 g/cc
Dielectric Constant @1MHz 4.0 MHz
Hardness 20 Shore 00
Outgassing (TML) 0.35%
Continuous Use Temperature -40 to 160℃
Dielectric Breakdown Voltage >5500 VAC
Thermal Conductivity 5 W/mK
Available Thickness 0.5mm to 5.0mm
Application Areas
  • Automotive engine control units
  • 5G telecommunication hardware
  • Artificial intelligence computing systems
  • Handheld portable electronics
  • Semiconductor automated test equipment (ATE)
  • High-speed mass storage drives
  • LED TV and LED-lit lamps
  • RDRAM memory modules
  • Micro heat pipe thermal solutions
Documentation & Resources

Standard Dimensions

Sheet Sizes: 8" x 16" (203mm x 406mm)

Available Thicknesses: 0.020" (0.51mm) to 0.200" (5.08mm) in multiple increments

Customization Options
  • Pressure-sensitive adhesive on one side (A1 suffix)
  • Pressure-sensitive adhesive on both sides (A2 suffix)
  • Fiberglass reinforcement available
  • Individual die-cut shapes upon request
Manufacturer Advantages
  • 13+ years of thermal interface material expertise
  • Proprietary formulations and core technologies
  • Free sample program available
  • Quality assurance contracts
  • Confidentiality and business secret protection
TIF500-50-11US Grey Silicone Thermal Pad for 5G and AI Applications

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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