TIF015-07 Thermal Conductive Silicone Potting Compound 1.5 W/mK with 4000 Pa.s Viscosity for Electronics
Price:
0.1-100USD/KG
MOQ:
1000tube
Delivery Time:
3-8 WORK DAYS
Brand:
Ziitek
Product Description
Product Overview
TIF015-07 is a soft silicone putty thermal gap filler engineered with an exclusive formula to deliver superior thermal performance and excellent compressibility. The high viscosity silicon oil base prevents thermal compound separation and provides better control over bonding shifting compared to traditional thermal pads.
Key Features
- Thermal conductivity: 1.5 W/mK
- Soft texture with very low compression force
- Low thermal impedance for efficient heat transfer
- Compatible with automated dispensing systems
- Proven long-term reliability in demanding applications
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Color | Green | Visual |
| Viscosity | 4000 Pa.s | GB/T 10247 |
| Specific Gravity | 2.5 g/cm³ | ASTM D297 |
| Thermal Conductivity | 1.5 W/mK | ISO 22007-2 |
| Thermal Diffusivity | 0.847 mm²/s | ISO 22007-2 |
| Specific Heat Capacity | 2.2 MJ/m³K | ISO 22007-2 |
| Operating Temperature | -45°C to 200°C | Continuous Use |
| Flame Rating | 94V0 | UL E331100 |
Applications
- Microprocessors and chip cooling
- PPGAs, Micro BGA, and BGA packages
- DSP chips and high-power electronic components
- LED lighting systems
- Automotive electronics
- IT infrastructure and data storage
- Audio/video components and set-top boxes
- GPS navigation and portable devices
- CD-ROM and DVD-ROM cooling systems
Packaging Options
Standard packaging includes 30 cc per piece (98 pieces per box) and 300 cc per piece (6 pieces per box). Custom syringe packaging is available for automated dispensing applications. Contact us for specific packaging requirements.
Technical Documentation
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Get in Touch
Have questions about our products or want to discuss a custom order? Our team is ready to help you.
Company
Dongguan Ziitek Electronical Material and Technology Ltd.
Location
No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person
Dana Dai