TIF1120-02F Ultra Soft CPU Thermal Conductive Pad 1.5W/m-K with Protective Liners 0.5mm to 5.0mm Thickness
The TIF1120-02F Series is an extremely soft gap filling material with 1.5W/m-K thermal conductivity, specially formulated for high-performance applications requiring low assembly stress. This ceramic-filled silicone elastomer offers exceptional thermal performance at low pressures and is highly conformal to rough or irregular surfaces.
- RoHS compliant with 1.5W/mK thermal conductivity
- UL recognized for safety compliance
- Fiberglass reinforced for enhanced puncture, shear and tear resistance
- Supplied with protective liners for ease of handling and installation
- Electrically isolating for safe operation
- High durability for long-term reliability
- Cooling components to chassis or frame
- High speed mass storage drives
- Heat sinking housing for LED-lit BLU in LCD displays
- LED TV and LED-lit lamps
- RDRAM memory modules
- Micro heat pipe thermal solutions
- Automotive engine control units
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 1.5 W/m-K | ASTM D5470 |
| Hardness | 60±5 Shore 00 | ASTM 2240 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D412 |
| Continuous Use Temperature | -40 to 160℃ | - |
| Fire Rating | 94 V0 | UL equivalent |
| Thickness Range | 0.020" (0.5mm) to 0.200" (5.0mm) | ASTM C351 |
Standard thicknesses range from 0.010" (0.25mm) to 0.200" (5.08mm) in various increments. Consult factory for alternate thickness requirements.
8" x 16" (203mm x 406mm). Individual die cut shapes available upon request.
Ziitek Electronic Material and Technology Ltd. specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. Certified with ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, and UL standards.
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