TIF1100-02S Gray White CPU Thermal Pad 1.5W/mK Conductivity 0.010-0.200 Inch Thickness

Price Negotiable

Price: 0.1-10 USD/PCS

MOQ: 1000pcs

Delivery Time: 3-5 work days

Brand: Ziitek

Product Description

Product Overview

TIF1100-02S Series gray white CPU thermal pads provide high-performance thermal management for electronic devices. These silicone-based thermal interface materials effectively reduce thermal resistance between heat sources and heat sinks.

Key Features

Thermal conductivity: 1.5W/mK
Available in multiple thicknesses from 0.010" to 0.200"
UL recognized and 94V0 fire rating
Broad range of hardness options (45 Shore 00)
High tack surface reduces contact resistance
Soft and compressible for low stress applications
Excellent moldability for complex parts
Continuous use temperature: -40°C to 160°C

Technical Specifications

Property	Value	Test Method
Color	Gray white	Visual
Specific Gravity	2.23 g/cc	ASTM D297
Hardness	45 Shore 00	ASTM 2240
Dielectric Breakdown Voltage	>1000 VAC	ASTM D412
Volume Resistivity	4.0×10¹² Ohm-meter	ASTM D257
Outgassing (TML)	0.30%	ASTM E595

Thermal Performance Data

Thickness	Thermal Impedance @10psi (°C-in²/W)
10mils / 0.254 mm	0.16
20mils / 0.508 mm	0.20
30mils / 0.762 mm	0.31
40mils / 1.016 mm	0.36
50mils / 1.270 mm	0.42

Applications

LED TV / LED lighting systems
CD/DVD-ROM cooling
CPU and display card thermal management
Memory modules and routers
Telecommunication hardware
GPS navigation and portable devices
SAD-DC power adapters
Micro heat pipe thermal solutions

Standard Sizes & Options

Sheet Sizes: 8" x 16" (203mm x 406mm), 16" x 18" (406mm x 457mm)

Customization: Individual die-cut shapes available with optional fiberglass reinforcement

Manufacturer Profile

Ziitek brings over 13 years of professional R&D experience in thermal interface materials, offering unique formulations and core technologies for quality thermal management solutions.

Quality Assurance