1.5W/mK CPU Thermal Pad for RDRAM Memory Modules - 0.010" to 0.200" Thickness Range with 45 Shore 00 Hardness
Price:
0.1-10 USD/PCS
MOQ:
1000pcs
Delivery Time:
3-5 work days
Brand:
Ziitek
Product Description
Product Overview
The TIF1100-07S Series thermal pads deliver outstanding thermal performance with 1.5W/mK conductivity, specifically engineered for RDRAM memory modules and CPU cooling applications. These ceramic-filled silicone elastomer pads provide reliable heat transfer while offering excellent electrical insulation properties.
Key Features
- High thermal conductivity: 1.5W/mK
- Available in multiple thicknesses from 0.010" to 0.200"
- Excellent moldability for complex component shapes
- Broad hardness range with 45 Shore 00 rating
- High tack surface reduces thermal contact resistance
- Easy release construction for simplified installation
- UL 94 V0 fire rating for enhanced safety
Primary Applications
- CPU and memory module cooling
- LED TV and lighting systems
- CD/DVD-ROM drives and power adapters
- Telecommunication hardware and IT infrastructure
- GPS navigation devices and portable electronics
- Motherboard and flexible LED strip applications
Technical Specifications
| Property | Value | Test Method |
|---|---|---|
| Thermal Conductivity | 1.5W/mK | ASTM D5470 |
| Thickness Range | 0.010" - 0.200" | ASTM C351 |
| Hardness | 45 Shore 00 | ASTM 2240 |
| Dielectric Breakdown Voltage | >10000 VAC | ASTM D412 |
| Operating Temperature | -40°C to 160°C | - |
| Fire Rating | 94 V0 | UL Equivalent |
| Volume Resistivity | 4.0×10¹² Ohm-meter | ASTM D257 |
Quality Certifications
ISO9001:2015, ISO14001:2004, IATF16949:2016, IECQ QC 080000:2017, UL
Thermal Impedance Data
| Thickness | Thermal Impedance @10psi (°C-in²/W) |
|---|---|
| 10mils / 0.254 mm | 0.16 |
| 20mils / 0.508 mm | 0.20 |
| 30mils / 0.762 mm | 0.31 |
| 40mils / 1.016 mm | 0.36 |
| 50mils / 1.270 mm | 0.42 |
Product Image
Technical Documentation
Manufacturer Information
Ziitek Electronic Material and Technology Ltd. specializes in developing composite thermal solutions and manufacturing superior thermal interface materials. With extensive experience in thermal engineering, we provide customized products, full product lines, and flexible production capabilities to meet diverse application requirements.
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Company
Dongguan Ziitek Electronical Material and Technology Ltd.
Location
No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person
Dana Dai