TIF112-12-10S-K1 Thermal Pad 1.2W/mK Conductivity 0.012" Thickness for CPU and Electronics Cooling

Price Negotiable
Price: 0.1-10 USD/PCS
MOQ: 1000pcs
Delivery Time: 3-5 work days
Brand: Ziitek
Product Description
TIF112-12-10S-K1 Series Thermal Interface Material
Product Overview

TIF112-12-10S-K1 Series thermally conductive interface materials are gap fillers reinforced one side with Kapton film and the other side with adhesive. These materials are designed to fill air gaps between heating elements and heat dissipation components, providing excellent thermal management for electronic devices.

TIF112-12-10S-K1 Series thermal pad product image showing gray thermal interface material
Key Features
  • Excellent thermal conductivity: 1.2W/mK
  • Available in various thickness options
  • UL recognized for safety compliance
  • Broad range of hardness options available
  • Moldable for complex component shapes
  • Outstanding thermal performance characteristics
  • High tack surface reduces contact resistance
  • RoHS compliant for environmental safety
Applications
  • LED TV and LED lighting systems
  • CD-ROM and DVD-ROM cooling solutions
  • AC-DC Power Adapters
  • CPU thermal management
  • Memory Modules cooling
  • Mass storage devices
  • Automotive electronics
  • Set top boxes
  • Audio and video components
  • IT infrastructure equipment
  • GPS navigation and portable devices
Technical Specifications
Property Value Test Method
Color Gray/Light amber Visual
Construction & Composition Ceramic filled silicone elastomer ***
Reinforcement carrier Polyimide film ***
Thickness range 0.012" (0.30mm) ASTM D374
Hardness 60±5 Shore C ASTM 2240
Specific Gravity 2.2 g/cc ASTM D792
Continuous Use Temperature -40 to 120℃ ***
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity 1.0×10¹² Ohm-meter ASTM D257
Fire rating 94 V0 UL E331100
Thermal conductivity 1.2W/m-K ASTM D5470
Quality Certifications
ISO9001:2015 ISO14001:2004 IATF16949:2016 IECQ QC 080000:2017 UL
Packaging & Delivery

Thermal pads are packaged with PET film or foam protection, separated by paper card layers, and shipped in export cartons. Custom packaging available upon request. Lead time for 5000 pieces: To be negotiated.

Ziitek Electronic Material manufacturing facility and team overview

Get in Touch

Have questions about our products or want to discuss a custom order? Our team is ready to help you.

Company Dongguan Ziitek Electronical Material and Technology Ltd.
Location No.12 Xiju Road, Hengli Township, Dongguan City, 523465 Guangdong Province, China
Contact Person Dana Dai

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