Copper Skiving Fin CPU Heat Sink

Copper skived fin heat sink offers highly optimized cooling as they allow for higher fin densities than what is manufacturable using extrusion methodologies, but do not have an interface joint that restricts heat flow like bonded or brazed fin heat sinks.

Product Description

A skived fin heat sink offers maximum thermal performance in a given space, compared with other manufacturing process, skiving technique offers thinner fins, denser fin pitch and high aspect ratio which provides more heat dissipation area, and due to the skived fins are sliced from the base, so the thermal resistance between the fin and base is very low, which makes the heat sink has great thermal conductivity. The thermal conductivity of copper is ~400W/m-k, which is best conductor of heat in all the commercial metals, so a copper skived fin heat sink can remove the heat from the CPU rapidly and dissipate to the air quickly. it is a great thermal solution for CPUs and other electronic components.

Product specifications