Copper Vapor Chamber Heatsink

Product Introduction

With the high frequency and high speed of electronic devices and the continuous improvement of the miniaturization and integration of integrated circuits, the heat dissipation per unit volume of electronic devices increases rapidly, so that the thermal control technology to ensure its safety and working reliability not only To have excellent heat transfer capacity and must also be able to adapt to heat dissipation. The vapor chamber cooling solution can achieve this effect.

Product Description:

Vapor Chambers, which work familiar with heatpipe principles, offer improved spreading efficiency, higher thermal conductivity, and reduced weight for CPUs, GPUS, and high performance telecom device.

Vapor Chambers leverage high heat transport capabilities of two phase cooling in a planar format. This makes Vapor Chamber Assemblies ideal components when spreading high heat densities or heat loads across a larger surface. By using Vapor Chambers, you can expect increased and more uniform heat spreading, which is ideal when optimizing heat sink performance.

Benefits and Advantages:

1. Allows ideal heat spreading over the base of a heat sink making all fins attached to it as efficient as possible

2. Enables much higher effective thermal conductivities

3. Reduce the hot spot on the heatsink base, improve the thermal performance

4. Less space needed , maximum spreading performance still available

Applications:

Mobile Devices including AR / VR

Gaming box

Server, Networking, & Telecom Enterprise applications

Medical equipment

industry

eMobility

Product Details: